CUSTOM DEVELOPMENT
We support custom optical source discussions from VCSEL wafer-level design, wavelength and output power definition, operating mode, array structure, package path, COB assembly, beam collimation, diffuser customization, coupling optics and module-level laser source integration.
VCSEL is our main product direction, covering standard wavelength directions from 650nm to 1064nm, with additional custom wavelength discussions available by project. Supported directions include single-mode VCSEL, multi-mode VCSEL, VCSEL array, CW / QCW / pulse operation, and selected discussions.
CUSTOMIZATION SCOPE
Custom laser source development from VCSEL wafer-level design to package, optics and module-level integration.
We provide project-specific VCSEL engineering from the wafer level, covering standard wavelength directions from 650nm to 1064nm, custom wavelengths, and optical output-power targets.
We provide single-mode and multi-mode VCSEL designs with CW, QCW, and pulse operation. Single-mode is suitable for atomic clocks, OPM magnetometers, and precision optical sources, while multi-mode supports higher-power sensing, medical-beauty, and module-level source projects.
VCSEL arrays are a core customization capability. We define emitter count, pitch, electrode routing, addressing method, target spot distribution, and 1D / 1.5D / 2D array layouts for sensing, structured-light, and high-NRE array projects.
Available package paths include SMD, TO-CAN, COB, ceramic submounts, and module-level structures. SMD support materials include PCT, aluminum nitride, alumina, and transparent resin carriers. TO package options include TO-46, TO-52, and TO-56 copper-can structures.
For multi-wavelength source platforms, integrated package discussions can support up to 6-in-1 wavelength combinations for medical beauty, phototherapy, multi-channel sensing, combined-wavelength sources and OEM platform development.
We provide COB source assemblies, high-power NIR modules, thermal-path design, beam collimation, diffuser customization, coupling optics, and module-level integration. Selected EEL, Laser Stack, and Nd:YAG pump modules are also available by project.
VCSEL ARRAY CAPABILITY
This section highlights VCSEL wafer-level customization and array development targets, including emission aperture, array layout, spectral consistency, power uniformity and operation mode. Final targets depend on wavelength, epitaxial structure, emitter count, layout, drive mode and package path.
We define the VCSEL emission aperture by project. Typical array designs use 5.5–6μm apertures, while the minimum aperture is approximately 4.5μm for compact, high-density array development.
We provide VCSEL arrays in 1D, 1.5D, and 2D emitter layouts, with project-specific emitter count, pitch, row arrangement, electrode routing, addressing method, and target spot distribution.
For selected custom array projects, spectral consistency is a key development target, with a ≤0.5nm target for applications requiring multi-emitter wavelength matching.
Array power uniformity is specified according to customer requirements, with a ≤10% target for sensing arrays, multi-point source designs, and high-consistency array projects.
CW, QCW, and pulse operation are selected according to thermal design, peak power, average power, drive conditions, package path, and system-level operating mode.
For array needs beyond standard products, NRE development can cover wafer-level design, emitter layout, aperture size, pitch, electrode routing, uniformity target and prototype iteration.
OPTICAL & MODULE DATA
Custom laser source projects may require package design, thermal path, beam collimation, diffuser customization, coupling optics, beam uniformity and module-level optical integration. Wafer-level optical resources can support micro-optics, lens arrays, gratings and silicon lens discussions.
Wafer-level optical resources can support 2–8 inch optical microstructure processes, including lithography, nanoimprint, etching, coating-related process discussion and 3D profile measurement.
Reference optical process data includes 8 inch wafer alignment accuracy of ±1μm, supporting discussions around MLA, silicon lens arrays, coupling optics and microstructure alignment.
Surface profile uniformity can be controlled toward ±0.4%, supporting micro-lens arrays, silicon lenses, coupling lenses and other wafer-level optical component discussions.
Silicon and quartz lens resources can cover φ5–900μm lens diameters for VCSEL collimation, coupling optics, silicon lens arrays and compact optical source designs.
Silicon lens reference data includes surface profile error below 25nm RMS, supporting high-precision coupling lenses, collimation lenses, lens arrays and micro-optical components.
Optical design discussions can include VCSEL collimation, diffuser customization, coupling optics, MLA, silicon lens arrays, custom spot size, beam uniformity and module-level optical path integration.
NEXT STEP
Send us your target wavelength, output power, operation mode, array layout, package preference, collimation or diffuser needs, working distance, spot size and application direction. We will check the suitable wafer-level, package, optical or module path.
VCSEL Bare Die, SMD Packages & Custom Development
