
678nm 5mW 2835 VCSEL SMD
678nm-typ. 5mW QCW VCSEL in a 2835 SMD package with a 22° annular beam for 678nm- and 680nm-class hair-growth helmet and scalp-light prototype evaluation.

678nm-typ. 5mW QCW VCSEL in a 2835 SMD package with a 22° annular beam for 678nm- and 680nm-class hair-growth helmet and scalp-light prototype evaluation.

650nm 5mW VCSEL SMD laser diode series with five PCT and ceramic package options, a lower-cost SMT alternative to TO-5.6 lasers for hair-growth devices.

680nm 50mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and high-output red VCSEL chip integration.

680nm 18mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 6-emitter red VCSEL chip integration.

680nm 12mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 4-emitter red VCSEL chip integration.

680nm 5mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and OEM red VCSEL chip integration.

680nm 5/12/18/50mW VCSEL Bare Die Series for wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.

680nm 5mW and 34mW peak-output QCW VCSEL SMD series in 2835, 3030 and 5730 packages for scalp PBM, localized red-light and OEM device integration.

670nm 12mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 6-emitter red VCSEL chip integration.

670nm 4mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and OEM red VCSEL chip integration.

670nm 9mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 4-emitter red VCSEL chip integration.

670nm 4/9/12mW VCSEL Bare Die Series for wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.

665nm 9mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 6-emitter red VCSEL chip integration.

665nm 8mW multi-mode VCSEL bare die with four emitters, 170 × 170μm die size and QCW output at 15mA for wire bonding and custom red laser packaging.

665nm 7mW multi-mode VCSEL bare die with four emitters, 170 × 170μm die size and QCW output at 18mA for wire bonding and custom red laser packaging.

665nm 3mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and OEM red VCSEL chip integration.

665nm 3/7/8/9mW VCSEL Bare Die Series for wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.

660nm 7mW VCSEL Bare Die for wire bonding, ceramic submount assembly, custom laser packaging, red VCSEL chip and custom OEM optical module integration.

660nm 5mW VCSEL Bare Die for die attach, wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.

660nm 2mW single-emitter VCSEL bare die for wire bonding, ceramic submount assembly, custom laser packaging and compact red-light module integration.

660nm 2mW, 5mW and 7mW VCSEL bare die series with single- and multi-emitter options for wire bonding, ceramic submounts and custom laser packaging.

660nm 5mW and 7mW VCSEL SMD series in 2016, 2835, 3030 and 5730 packages for beauty masks, hair-growth devices, PCB integration and OEM optical design.