660nm
660nm 2mW VCSEL Bare Die
660nm 2mW single-emitter VCSEL bare die for wire bonding, ceramic submount assembly, custom laser packaging and compact red-light module integration.
Specifications
- Product Type
- Multi-mode VCSEL Bare Die
- Wavelength
- 660 nm typ.
- Optical Output Power
- 2mW class, 1.5–2.5mW @ IF = 10mA, 25°C
- Emitter Configuration
- Single Emitter
- Operating Mode
- QCW, 0.5ms Pulse Width, 1% Duty Cycle
- Die Size
- 200±10 μm × 200±10 μm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 660nm 2mW VCSEL Bare Die for Packaging and Module Integration
The 660nm 2mW VCSEL Bare Die is a single-emitter, multi-mode visible-red VCSEL chip and red VCSEL laser chip developed for chip-level packaging, die attach, wire bonding, ceramic-submount assembly and custom laser-module integration.
This low-power red VCSEL die provides an optical output range of 1.5–2.5mW under a 10mA, 25°C QCW test condition. Its 200μm × 200μm square footprint and single-emitter configuration support projects requiring a simple emitter layout, relatively low drive current and compact package dimensions.
This VCSEL laser chip is intended for:
- OSAT semiconductor assembly and test providers
- VCSEL and laser-diode packaging companies
- SMD, TO-can and ceramic package developers
- Die-attach and wire-bonding engineering teams
- Ceramic-submount and COB integrators
- Laser-module and optoelectronic-module manufacturers
- Lens, collimation and beam-shaping companies involved in laser-source integration
- Laser bare-die, component and optical-module distributors
- Technical sourcing and second-source development teams
The VCSEL die can be integrated into custom SMD packages, TO-can packages, ceramic packages and compact optical modules. As an unpackaged semiconductor chip, it requires suitable mounting, bonding, thermal-path, package and optical-integration processes before use in a finished device or module.
2. Optical Configuration and Packaging Direction
The 660nm 2mW VCSEL chip uses a single-emitter, multi-mode structure for low-power optical-source packaging and early-stage packaging-process development.
Parameter | Value |
|---|---|
Optical Output Power | 1.5–2.5mW @ IF = 10mA |
Center Wavelength | 660nm typ. |
Wavelength Range | 658nm min. / 660nm typ. |
Threshold Current | 3.0mA typ. |
Forward Voltage | 2.5V typ. @ IF = 10mA |
Slope Efficiency | 0.2W/A min. / 0.35W/A typ. |
Power Conversion Efficiency | 12% typ. @ IF = 10mA |
Beam Divergence | 20° typ. @ IF = 10mA |
Operating Condition | QCW, 0.5ms pulse width, 1% duty cycle |
Die Size | 200μm × 200μm |
Die Thickness | 130μm |
Bond Pad Size | 90μm × 90μm |
The device can be supplied as VCSEL die for packaging in:
- Die-attach process development
- Wire-bonding verification
- Ceramic-submount assemblies
- Chip-on-submount assembly
- Custom SMD laser packages
- TO-can and ceramic packages
- Compact visible-red optical modules
- Lens and beam-shaping optical assemblies
Compared with the multi-emitter 660nm 5mW and 7mW models, the 2mW device is positioned as the single-emitter, lower-output option for projects prioritizing a simple optical-emission layout, compact bare-die integration and early-stage packaging-process validation.
3. Packaging, Optical Module and Application Development
OSAT and Custom Laser Packaging
The 660nm 2mW bare die supports wire-bonding VCSEL projects, ceramic-submount assembly and application-specific laser-device development.
Packaging directions include:
- VCSEL die attach
- Wire-bonding process verification
- Custom SMD laser packages
- TO-can laser packages
- Ceramic laser packages
- Ceramic-submount optical sources
- Chip-on-submount assembly
- Compact COB and optical modules
- Single-emitter visible-red devices
The single-emitter structure allows packaging teams to develop a compact red VCSEL source without the emitter-layout complexity of a multi-emitter die.
Lens and Optical Module Integration
The device can support lens, collimation and beam-shaping companies developing integrated laser-source assemblies.
Possible integration directions include:
- Collimation-lens assemblies
- Beam-shaping optical components
- Diffuser-integrated modules
- Lens-integrated VCSEL sources
- Compact visible-red optical modules
- Single-emitter red VCSEL source modules
Downstream Application Development
The datasheet identifies sensor light sources, consumer electronic products, machine vision and red lighting as application directions.
The device can also support:
- Compact visible-red laser modules
- Alignment and indication sources
- Optical sensor light sources
- Engineering and research light sources
- Machine-vision support illumination
- Beauty and personal-care prototypes
- Photobiomodulation-related optical development
- Hair-growth and scalp-light device development
These are downstream directions after the VCSEL bare die has been integrated into an appropriate package or optical module. The primary focus of this page remains bare-die supply, wire bonding, custom packaging and module integration.
The product is also available to laser-component agents, module distributors and second-source development teams supporting customer packaging and integration projects.
4. Evaluation Kit and Documentation Support
The 660nm 2mW VCSEL Bare Die is available as an Evaluation Kit for packaging trials, die-attach development, wire-bonding verification and initial optical integration.
- 10 pcs / KIT
- Product datasheet and die-dimension documentation
- International shipping quoted according to destination
- Center wavelength, wavelength tolerance, optical output power, power-bin selection and emitter-configuration requirements can be discussed
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
5. Frequently Asked Questions
FAQ 1. What packaging methods are suitable for the 660nm 2mW VCSEL Bare Die?
The device can be used for die attach, wire bonding, ceramic-submount assembly, chip-on-submount assembly, custom SMD packages, TO-can packages, ceramic packages and compact optical-module integration.
As an unpackaged die, it must be integrated using an appropriate mounting, bonding, thermal-path and package design.
FAQ 2. What is the emitter configuration of the 660nm 2mW VCSEL Bare Die?
The device uses a single-emitter structure and has a 200μm × 200μm die footprint.
It provides 1.5–2.5mW optical output under a 10mA, 25°C QCW test condition, with a typical beam divergence of approximately 20°. The QCW condition uses a 0.5ms pulse width and 1% duty cycle.
FAQ 3. Can the wavelength, optical output, power bin or package configuration be customized?
Center wavelength, wavelength tolerance, optical output, power-bin selection and package-integration requirements can be discussed according to the project.
Projects requiring different output levels or emitter configurations can select from the 660nm 2mW, 5mW and 7mW VCSEL Bare Die models or submit a custom-development request.