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780–850nm NIR VCSELs
25 products
2835 VCSEL SMD package for standard PCB assembly
850nm

850nm 20mW 2835 VCSEL SMD

850nm 20mW 2835 VCSEL SMD with 23mW typical output at 28mA, 21° D86 divergence and SMT packaging for stronger pulsed NIR sources and OEM modules.

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2835 VCSEL SMD package for standard PCB assembly
850nm

850nm 10mW 2835 VCSEL SMD

850nm 10mW 2835 VCSEL SMD with 10mW typical output at 15mA, 21° D86 beam divergence and SMT packaging for compact NIR sensing and OEM module projects.

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2835 VCSEL SMD package for standard PCB assembly
850nm

850nm 5mW 2835 VCSEL SMD

850nm 5mW 2835 VCSEL SMD with 6mW typical output, 7mA QCW drive and 20° D86 beam divergence for compact NIR sensing, PCB and OEM integration projects.

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850nm 6W multi-emitter VCSEL bare die for high-power NIR illumination and custom packaging
850nm

850nm VCSEL Bare Die Series

850nm VCSEL bare die series from 5mW to 6W, with QCW, pulse and selected CW options for wire bonding, OEM custom packaging and optical module projects.

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850nm 6W multi-emitter VCSEL bare die for high-power NIR illumination and custom packaging
850nm

850nm 6W VCSEL Bare Die

850nm 6W VCSEL bare die with 5.5W typical QCW output, 1273 emitters and 19° beam divergence for NIR illumination, ceramic assembly and custom packaging.

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850nm 3W VCSEL bare die with 624 emitters for machine vision, NIR illumination and custom packaging.
850nm

850nm 3W VCSEL Bare Die

850nm 3W VCSEL bare die with 3.5W typical QCW output, 624 emitters and 21° beam divergence for NIR illumination, ceramic assembly and custom packaging.

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850nm 300mW VCSEL laser chip for near-infrared sensing, custom packaging and optical-module integration
850nm

850nm 300mW VCSEL Bare Die

850nm 300mW VCSEL bare die with 320mW typical QCW output, 48 emitters and 20° beam divergence for sensing, machine vision and OEM optical modules.

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850nm 100mW rectangular VCSEL bare die with 785 × 200μm multi-emitter structure
850nm

850nm 100mW VCSEL Bare Die

850nm 100mW VCSEL bare die with three die-size and emitter-layout options for sensing, machine vision, wire bonding and OEM custom VCSEL packaging.

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850nm 5mW single-emitter VCSEL bare die for sensing and custom packaging
850nm

850nm 5mW VCSEL Bare Die

850nm 5mW VCSEL bare die with 6mW typical output, 7mA QCW operation and a 170 × 170μm single-emitter die for sensing and OEM custom packaging projects.

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2835 VCSEL SMD package for standard PCB assembly
808nm

808nm 20mW 2835 VCSEL SMD

808nm 20mW 2835 VCSEL SMD with 20mW typical optical output, 21° typical D86 divergence and pulsed/QCW operation for higher-output PCB sensing modules.

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2835 VCSEL SMD package for standard PCB assembly
808nm

808nm 10mW 2835 VCSEL SMD

808nm 10mW 2835 VCSEL SMD with 10mW typical optical output, 21° typical D86 divergence and pulsed/QCW operation for compact PCB sensing integration.

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VCSEL SMD 3030 package for compact PCB optical integration
808nm

808nm 5mW 3030 VCSEL SMD

808nm 5mW 3030 VCSEL SMD with 5.5mW typical optical output, 21° typical D86 divergence and pulsed/QCW operation for compact PCB sensing projects.

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808nm 66W VCSEL COB module with a spatially homogenized 2.8 × 1.0 cm spot
808nm

808nm 66W VCSEL COB Module

808nm 66W VCSEL COB module with a 2.8 × 1.0 cm homogenized spot for QCW hair removal equipment light-source development and high-power NIR integration.

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High-power 808nm VCSEL bare die, model D-V0808M-3000-0043, delivering 1.5W optical output in a 34 mil chip format for NIR illumination, sensing, and custom optical module integration.
808nm

808nm 8W VCSEL Bare Die

808nm 8W multi-mode VCSEL bare die with 1958 emitters for QCW NIR source, hair removal equipment light-source development and custom packaging projects.

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