850nm VCSEL Bare Die Series
850nm VCSEL bare die series from 5mW to 6W, with QCW, pulse and selected CW options for wire bonding, OEM custom packaging and optical module projects.
Specifications
- Product Type
- 850nm VCSEL Bare Die Series
- Wavelength
- 850 nm typ.
- Optical Output Power
- 5mW / 20mW / 30mW / 70mW / 100mW / 200mW / 300mW / 400mW / 500mW / 1W CW / 1.5W / 2W Pulse / 2W CW / 3W / 6W
- Emitter Configuration
- Single-emitter / multi-emitter / VCSEL array die options
- Operating Mode
- Pulse / QCW / CW options
- Die Size
- 163–1340μm × 170–1500μm, model-dependent
- Recommended Assembly
- Wire bonding / ceramic submount / custom packaging
1. 850nm VCSEL Bare Die Supply for Packaging and Module Integration
The 850nm 5mW–6W VCSEL Bare Die Series includes 850nm VCSEL chips, VCSEL laser chips and multi-emitter VCSEL array options for customers sourcing near-infrared bare die for packaging and optical-module integration.
The available output-power classes range from 5mW to 6W, covering low-power single-emitter devices, compact multi-emitter chips, medium-power arrays, high-power pulse devices and selected continuous-wave VCSEL models. Depending on the selected configuration, QCW, Pulse or CW operation is available. The applicable operating conditions should be confirmed in the corresponding product datasheet.
These 850nm multi-mode VCSEL devices are supplied as unpackaged semiconductor bare die for die attach, gold-wire bonding, ceramic-submount assembly, custom VCSEL packaging and optical-module integration.
The different optical-output levels, emitter configurations, die dimensions and operating modes allow packaging companies and module-development teams to select a suitable model according to package space, target optical output, pulse condition, emitter layout, thermal path and optical-system requirements.
This series is intended for:
- OSAT semiconductor assembly and test providers
- VCSEL and laser-diode packaging companies
- SMD, TO-can and ceramic laser-package manufacturers
- Die-attach and gold wire-bonding engineering teams
- Ceramic-submount and COB integrators
- NIR illumination and optical-module manufacturers
- Lens, diffuser, collimation and beam-shaping companies
- Laser-component, bare-die and optical-module distributors
- Technical sourcing and second-source development teams
As an 850nm VCSEL bare die supplier, 1ONELASER supports bare-die supply, model selection, power-bin discussion, OSAT packaging, ceramic-submount integration and custom optical-module development.
The devices can be integrated into custom SMD packages, TO-can packages, ceramic laser packages, ceramic-submount assemblies, COB light sources and application-specific near-infrared optical modules. As unpackaged semiconductor chips, these products require appropriate die mounting, wire bonding, thermal-path design, package protection and optical integration before use in a finished device or module.
Contact 1ONELASER to discuss 850nm VCSEL bare-die supply and packaging requirements.
2. 5mW to 6W VCSEL Bare Die Model Selection
The 850nm VCSEL Bare Die Series covers low-power, medium-power, high-power pulse and selected continuous-wave configurations.
Model selection should consider optical output, operating mode, drive current, pulse width, duty cycle, beam divergence, die dimensions, emitter configuration, package structure and thermal requirements.
| Model | Optical Output Power | Operating Mode | Test Condition | Beam Divergence |
|---|---|---|---|---|
| 850nm 5mW | 5mW min. / 6mW typ. | QCW / Pulse | 7mA, 25°C, 0.5ms, 1% duty cycle | 20° typ., 1/e² |
| 850nm 20mW | 20mW min. / 23mW typ. | QCW / Pulse | 28mA, 25°C, 0.5ms, 10% duty cycle | 21° typ., 1/e² |
| 850nm 30mW | 30mW min. / 34mW typ. | QCW / Pulse | 42mA, 25°C, 1ms, 10% duty cycle | 20° typ., 1/e² |
| 850nm 70mW | 65mW min. / 70mW typ. / 80mW max. | QCW / Pulse | 84mA, 25°C, 0.1ms, 10% duty cycle | 20° typ., 1/e² |
| 850nm 100mW Compact Die | 100mW min. / 115mW typ. | QCW / Pulse | 140mA, 25°C, 1ms, 10% duty cycle | 20° typ., 1/e² |
| 850nm 100mW Square Die | 100mW min. / 120mW typ. | QCW / Pulse | 140mA, 25°C, 0.5ms, 1% duty cycle | 20° typ., 1/e² |
| 850nm 100mW Rectangular Die | 110mW min. / 120mW typ. / 130mW max. | QCW / Pulse | 140mA, 25°C, 0.1ms, 10% duty cycle | 20° typ., 1/e² |
| 850nm 200mW | 220mW min. / 240mW typ. / 260mW max. | QCW / Pulse | 280mA, 25°C, 0.1ms, 10% duty cycle | 22° typ., 1/e² |
| 850nm 300mW | 300mW min. / 320mW typ. / 360mW max. | QCW / Pulse | 350mA, 25°C, 0.1ms, 10% duty cycle | 20° typ., 1/e² |
| 850nm 400mW | 420mW min. / 450mW typ. / 480mW max. | QCW / Pulse | 500mA, 25°C, 0.1ms, 10% duty cycle | 25° typ., 1/e² |
| 850nm 500mW | 500mW min. / 580mW typ. | QCW / Pulse | 700mA, 25°C, 0.5ms, 1% duty cycle | 20° typ., 1/e² |
| 850nm 1W CW | 1.0W min. / 1.2W typ. | CW | 1.4A, 25°C, CW | 20° typ., 1/e² |
| 850nm 1.5W | 1.5W min. / 1.7W typ. | QCW / Pulse | 2A, 25°C, 0.5ms, 1% duty cycle | 20° typ., 1/e² |
| 850nm 2W QCW | 2.0W min. / 2.2W typ. | QCW / Pulse | 2.8A, 25°C, 0.5ms, 1% duty cycle | 21° typ., 1/e² |
| 850nm 2W CW | 1.9W min. / 2.1W typ. | CW | 2.2A, 20°C, CW | 22° typ., 1/e² |
| 850nm 3W | 3.0W min. / 3.5W typ. | QCW / Pulse | 4A, 25°C, 0.5ms, 1% duty cycle | 21° typ., 1/e² |
| 850nm 6W | 5.0W min. / 5.5W typ. / 6.0W max. | QCW / Pulse | 7A, 25°C, 0.1ms, 3% duty cycle | 19° typ., 1/e² |
The optical-output values and test conditions are model-specific. A power value measured under one pulse condition should not be interpreted as directly equivalent to a CW output rating or to another device tested at a different pulse width, duty cycle or temperature.
The beam-divergence value should also be confirmed according to the corresponding product datasheet and actual test condition.
Available 100mW VCSEL Die Formats
Three 850nm 100mW VCSEL bare die formats are available for different package dimensions, emitter-layout requirements and pulse conditions.
| 100mW Option | Die Size | Emitter Count | Optical Output | Pulse Condition |
|---|---|---|---|---|
| Compact Die | 245 × 239μm | 23 emitters | 100mW min. / 115mW typ. | 1ms, 10% duty cycle |
| Square Die | 300 × 300μm | 21 emitters | 100mW min. / 120mW typ. | 0.5ms, 1% duty cycle |
| Rectangular Die | 785 × 200μm | 22 emitters | 110mW min. / 120mW typ. / 130mW max. | 0.1ms, 10% duty cycle |
The three options are not interchangeable versions of the same mechanical design. They differ in die dimensions, emitter count, emitter layout and pulse test condition.
The appropriate 100mW die should be selected according to available package space, bond-pad orientation, optical-source geometry, pulse requirements and module architecture.
850nm 5mW VCSEL Bare Die
The 850nm 5mW VCSEL bare die is a compact single-emitter option with a 170 × 170μm-class die footprint.
It is intended for low-power NIR source packaging, die-attach development, wire-bonding process validation, compact sensor sources and initial optical-module evaluation.
View the 850nm 5mW VCSEL Bare Die.
850nm 100mW VCSEL Bare Die Options
The 850nm 100mW product page covers compact, square and rectangular multi-emitter die formats.
These selected configurations allow customers to compare die size, emitter layout, optical-output range and pulse conditions within the same 100mW power class.
View the 850nm 100mW VCSEL Bare Die options.
850nm 300mW VCSEL Bare Die
The 850nm 300mW VCSEL bare die provides 320mW typical optical output under a 350mA pulse condition.
Its multi-emitter configuration can be evaluated for NIR illumination, machine-vision source development, industrial optical detection and custom packaged VCSEL modules requiring a medium-power array die.
View the 850nm 300mW VCSEL Bare Die.
850nm 2W CW and QCW VCSEL Bare Die
The 850nm 2W product page covers separate continuous-wave and QCW VCSEL bare die configurations within the same approximate output-power class.
The 2W CW model provides 2.1W typical output under a 2.2A continuous-wave test condition. The separate 2W QCW chip provides 2.2W typical output under a 2.8A pulse condition. These devices require different drive, thermal-path and package-level validation.
View the 850nm 2W CW and QCW VCSEL Bare Die options.
850nm 3W VCSEL Bare Die
The 850nm 3W VCSEL bare die provides 3.5W typical optical output under a QCW pulse condition.
The array can be evaluated for high-power NIR illumination, active optical detection, machine-vision source development and custom high-power VCSEL package integration.
View the 850nm 3W VCSEL Bare Die.
850nm 6W VCSEL Bare Die
The 850nm 6W VCSEL bare die provides 5.5W typical and 6W maximum optical output under a 7A pulse condition.
It is the highest-power option currently included in this 850nm VCSEL Bare Die Series. The device can be evaluated for high-power NIR illumination, machine vision, industrial sensing and custom optical-source modules requiring a large multi-emitter array die.
View the 850nm 6W VCSEL Bare Die.
Other Available Power Options
The 20mW, 30mW, 70mW, 200mW, 400mW, 500mW, 1W CW, 1.5W and 2W QCW models are currently covered by this Series page rather than separate product pages.
Customers can select these models according to target optical output, operating mode, package space, emitter configuration, pulse requirements and thermal design.
3. Packaging, Optical Module and Application Development
OSAT and Custom VCSEL Packaging
The 850nm VCSEL bare die can be supplied for wire-bonded ceramic-submount assemblies, custom SMD packages, TO-can packages, ceramic laser packages and application-specific optical modules.
Packaging and integration directions include:
- VCSEL die attach
- Gold-wire bonding
- Ceramic-submount assembly
- Custom VCSEL packaging
- Custom SMD laser packages
- TO-can laser packages
- Ceramic laser packages
- COB optical-source assemblies
- Multi-emitter VCSEL array modules
- Application-specific NIR source packages
The wide optical-output range allows packaging companies to select a device according to package dimensions, bond-pad layout, output requirements, operating mode, thermal path and module structure.
Lens, Diffuser and Beam-Shaping Integration
The series can support optical companies developing lens-integrated, diffuser-integrated, collimated or beam-shaped near-infrared source assemblies.
Possible integration directions include:
- Collimation-lens assemblies
- Beam-shaping optical components
- Diffuser-integrated VCSEL modules
- Lens-integrated NIR sources
- FOV-controlled illumination modules
- Compact machine-vision light sources
- Application-specific optical assemblies
Final optical performance depends on the selected VCSEL die, beam divergence, lens or diffuser design, working distance, package structure and mechanical alignment.
Sensing, Machine Vision and NIR Illumination
The 850nm VCSEL Bare Die Series can support development and evaluation in the following directions:
- Near-infrared sensing
- Proximity and distance-detection source development
- Machine-vision support illumination
- Industrial optical-detection development
- Active NIR illumination
- Consumer-electronics optical-source development
- Engineering and research light sources
- Custom optoelectronic modules
For application-level source selection and optical-system planning, visit the Sensing & Machine Vision solution page.
High-Power and CW Optical-Source Development
The 1W CW, 2W CW, 2W QCW, 3W and 6W options support projects requiring higher optical output, larger VCSEL arrays and more substantial electrical, package and thermal design.
CW and high-power pulse devices require different electrical-drive, thermal-path and package-level validation. The optical output of a QCW model should not be interpreted as a continuous-wave rating.
For high-power source, thermal and module-development directions, visit High-Power NIR & Optical Modules.
Distribution and Supply-Chain Support
The 850nm VCSEL Bare Die Series is available to laser-component distributors, optical-module suppliers, technical sourcing companies and second-source development teams supporting customer packaging and integration projects.
Documentation, evaluation samples, volume-supply requirements and selected model configurations can be discussed according to the project stage.
4. Evaluation Kit and Documentation Support
The 850nm VCSEL Bare Die Series is available as an Evaluation Kit for packaging trials, die-attach development, wire-bonding verification and initial optical integration.
The Evaluation Kit includes:
- 10 pcs / KIT
- One selected 850nm VCSEL bare die model per kit
- Corresponding product datasheet
- Die-dimension and assembly documentation
- International shipping quoted according to destination
The following requirements can be discussed according to the project:
- Center wavelength
- Wavelength tolerance
- Optical output power
- Power-bin selection
- CW or QCW operating requirements
- Emitter configuration
- Die size and bond-pad layout
- Ceramic-submount requirements
- Custom SMD, TO-can or ceramic packaging
- Optical-module integration
- Volume-supply requirements
Request an 850nm VCSEL Bare Die Evaluation Kit.
Submit a Custom Development & ODM request.
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available.
Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
5. Frequently Asked Questions
FAQ 1. What 850nm VCSEL bare die power and operating-mode options are available?
The 850nm VCSEL Bare Die Series covers optical-output options from 5mW to 6W. Most models are specified for QCW or Pulse operation, while selected 1W and 2W devices are available for continuous-wave operation.
The range includes single-emitter chips, compact multi-emitter dies, medium-power arrays, high-power pulse devices and selected CW products. Each model should be evaluated using its complete drive current, pulse width, duty cycle, temperature, beam divergence and thermal requirements rather than optical-output power alone.
FAQ 2. How should I select an 850nm VCSEL bare die for packaging and module integration?
Selection should consider target optical output, CW or QCW operation, drive current, pulse width, duty cycle, die dimensions, emitter layout, bond-pad orientation, package space, thermal path and external optics.
Low-power devices can support compact sensor-source and initial packaging projects, while medium-power and high-power arrays can support NIR illumination and custom optical modules. Three different 100mW die formats are also available. Final selection should be confirmed using the corresponding datasheet and the customer’s actual package and optical architecture.
FAQ 3. What is the difference between the 850nm VCSEL Bare Die Series and the 850nm VCSEL SMD Series?
The 850nm VCSEL Bare Die Series consists of unpackaged semiconductor chips intended for OSAT providers, laser-packaging companies, die-attach and wire-bonding teams, ceramic-submount integrators and optical-module manufacturers. These devices require die attachment, wire bonding, package protection, thermal design and optical integration.
The 850nm VCSEL SMD Series consists of completed surface-mount devices intended for SMT placement, reflow soldering and direct PCB-level integration. Customers who do not require bare-die assembly may select an SMD package.
850nm 5mW VCSEL Bare Die Datasheet Download ↓
850nm 20mW VCSEL Bare Die Datasheet Download ↓
850nm 30mW VCSEL Bare Die Datasheet Download ↓
850nm 70mW VCSEL Bare Die Datasheet Download ↓
850nm 100mW Compact VCSEL Bare Die Datasheet Download ↓
850nm 100mW Square VCSEL Bare Die Datasheet Download ↓
850nm 100mW Rectangular VCSEL Bare Die Datasheet Download ↓
850nm 200mW VCSEL Bare Die Datasheet Download ↓
850nm 300mW VCSEL Bare Die Datasheet Download ↓
850nm 400mW VCSEL Bare Die Datasheet Download ↓
850nm 500mW VCSEL Bare Die Datasheet Download ↓
850nm 1W CW VCSEL Bare Die Datasheet Download ↓
850nm 1.5W VCSEL Bare Die Datasheet Download ↓
850nm 2W QCW VCSEL Bare Die Datasheet Download ↓
850nm 2W CW VCSEL Bare Die Datasheet Download ↓