Product Overview
1. Standard Bare Die VCSEL for Low-Power NIR Sensing
This 850nm 5mW VCSEL bare die is designed for low-power near-infrared sensing, compact optical source evaluation, consumer electronics sensing, machine vision auxiliary illumination, and small-size NIR module development.
The product is supplied as a standard bare die device by default. It is suitable for proximity sensing evaluation, compact optical sensing modules, low-current NIR source designs, laboratory optical source testing, and chip-level VCSEL integration projects.
With 5mW typical optical output power at IF = 7mA, this device provides a compact and efficient 850nm VCSEL source for low-power sensing, optical alignment, beam evaluation, and customer-specific package or module development.
2. Key Features
This 850nm 5mW VCSEL bare die is supplied as a standard low-power VCSEL chip for compact NIR sensing and optical source evaluation applications.
Key features include 850nm typical wavelength, 5mW typical optical output power, low operating current, low threshold current, single-emitter bare die structure, stable central wavelength, narrow linewidth, and doughnut-shaped symmetrical far-field output.
The bare die format allows flexible integration into ceramic submounts, chip-on-board assemblies, compact optical modules, and customer-specific VCSEL packages.
Package-level assembly, wire bonding, ceramic submount mounting, beam shaping, divergence control, and customer-specific optical spot requirements can also be reviewed according to the customer's optical and mechanical layout.
3. Application Development Direction
This device supports low-power 850nm NIR sensing applications, proximity sensing, consumer electronics optical sensing, machine vision evaluation, industrial detection, and compact VCSEL optical source integration.
In a sensing or optical module design, the VCSEL wavelength, output power, drive current, beam profile, detector response, optical path, package structure, thermal condition, and final system signal behavior should be reviewed together.
The 5mW typical output power provides a useful low-power source option for compact optical path design, especially where small chip size, low drive current, bare die integration, or customized VCSEL package development is required.
4. Evaluation Sample Kit and Documentation Support
Evaluation Sample Kit: USD 29 / KIT, 10 PCs / KIT. International express shipping is typically USD 69–89 depending on destination.
BestLaser Opto Component Device Limited has filed an Initial Product Report with the U.S. FDA CDRH for the Laser Diode Series, including the VCSEL Laser Diode Chip Series. CE-related documentation is also available for project evaluation, including EMC documentation and EN 60825 laser safety / LVD test documentation. Material compliance documentation, including RoHS, REACH, and HF documentation, can also be provided upon request.
For 850nm sensing and compact optical source projects, bare die mounting, ceramic submount assembly, chip-on-board integration, wire bonding, beam shaping, or customized package discussion is available according to the project requirements.
Please contact us for sample testing, engineering evaluation, or custom project support.
850nm 5mW VCSEL Bare Die Datasheet Download ↓
