808nm
808nm 5mW 3030 VCSEL SMD
808nm 5mW 3030 VCSEL SMD with 5.5mW typical output, Pulse/QCW operation and 21° D86 divergence for SMT, PCB and beauty-device integration.
Specifications
- Product Type
- VCSEL SMD
- Wavelength
- 808nm typ. (800–816nm)
- Optical Output Power
- 5.5mW typ.; 6mW max.
- Transverse Mode
- Multi-mode VCSEL
- Operating Mode
- Pulse / QCW
- Beam Divergence
- 21° typ. (18–24°)
- SMD Package Options
- 3030
1. 808nm 5mW 3030 VCSEL SMD for PCB Integration
The 808nm 5mW 3030 VCSEL SMD is a compact near-infrared VCSEL device supplied in a 3030 surface-mount package. It provides a typical peak wavelength of 808nm and a typical optical output power of 5.5mW.
This 5mW 808nm VCSEL diode is specified for Pulse / QCW operation. Under a test condition of IF = 7mA, 25°C, 0.5ms pulse width and 1% duty cycle, the device provides 5.5mW typical optical output.
Compared with an unpackaged VCSEL bare die, the 3030 VCSEL package has already completed the die-packaging process. It can be used for SMT placement, reflow soldering and PCB-level optical-source integration without requiring the customer to perform die attach and gold wire bonding.
The device can support compact near-infrared sources, PCB-level optical assemblies, sensing, machine-vision support illumination, industrial optical detection, beauty and personal-care equipment light-source development, and engineering prototype validation.
The 3030 package dimensions, electrode orientation, PCB pad design and assembly conditions should be confirmed using the corresponding product datasheet and package drawing. The device is ESD-sensitive and requires appropriate electrostatic protection during storage, handling, placement and testing.
2. Optical and Electrical Characteristics
The principal optical and electrical characteristics of the 808nm 5mW 3030 VCSEL SMD are shown below.
Parameter | Minimum | Typical | Maximum | Test Condition |
|---|---|---|---|---|
Peak Wavelength | 800nm | 808nm | 816nm | — |
Optical Output Power | — | 5.5mW | 6mW | IF = 7mA, 25°C, QCW, 0.5ms, 1% duty cycle |
Threshold Current | — | 2mA | — | 25°C |
Forward Voltage | 1.8V | 2.0V | 2.2V | IF = 7mA |
Beam Divergence, D86 | 18° | 21° | 24° | 25°C |
Slope Efficiency | — | 1W/A | — | — |
Series Resistance | — | 75Ω | — | — |
Wavelength Temperature Shift | — | 0.047nm/°C | — | — |
The values above are representative parameters from the current product specification. Exact minimum, typical and maximum values, test conditions and tolerances should be confirmed in the corresponding product datasheet.
Beam divergence is specified using the D86 definition and should not be directly replaced by an FWHM or another beam-angle definition.
This device is specified for Pulse / QCW operation and should not be interpreted as a continuous-wave product. Performance in the final PCB assembly will also depend on drive current, pulse width, duty cycle, PCB thermal design and the external optical structure.
3. 3030 Package and SMT Integration
The 808nm 5mW VCSEL uses a 3030 surface-mount package for standard PCB optical-source layouts, automated placement and reflow-soldering processes.
The packaged configuration reduces the development work associated with bare-die mounting, gold wire bonding and package protection. It is suitable for projects requiring a completed surface-mount VCSEL for PCB-level integration.
Integration directions include:
- Automated SMT placement
- Reflow-soldering assembly
- Compact PCB optical-source layouts
- Single-device near-infrared sources
- Multi-device PCB optical arrays
- Sensing and detection circuit integration
- Near-infrared optical-assembly development
- Engineering prototypes and small-batch validation
PCB pad dimensions, device polarity, placement orientation and package dimensions should follow the 3030 package drawing.
The reflow profile, PCB material, copper-layer design and thermal conditions around the device should be confirmed according to the customer’s production process. A specific reflow-temperature profile should not be assumed without reference to the corresponding assembly documentation.
The standard reel quantity is:
- 4000 pcs / reel
For projects requiring die attach, gold wire bonding or a customer-specific package, view the 808nm VCSEL Bare Die Series.
4. Application Development
The 808nm 5mW 3030 VCSEL SMD is primarily intended for near-infrared optical-source projects requiring low optical power, a compact package and PCB-level integration.
Application directions include:
- Near-infrared sensing
- Machine-vision support illumination
- Industrial optical detection
- Compact near-infrared light sources
- Beauty and personal-care equipment light-source development
- Wearable personal-care products
- Multi-wavelength beauty-device optical assemblies
- Consumer-electronics optical assemblies
- PCB-level optical-source development
- Engineering and research prototypes
- Multi-device near-infrared PCB arrays
Beauty and Personal-Care Equipment Light-Source Development
The 808nm 5mW 3030 VCSEL SMD can support PCB-level optical-source development for compact beauty equipment, personal-care products, wearable near-infrared products and multi-wavelength beauty devices.
The 3030 surface-mount package supports automated placement, reflow soldering and multi-device PCB layouts for beauty products with requirements relating to product thickness, optical-source spacing and volume assembly.
The product operates in Pulse / QCW mode. The number of VCSEL devices, PCB layout, driving conditions and optical structure should be determined according to the optical-source configuration of the customer’s equipment.
For further information about VCSEL integration in beauty and personal-care equipment, visit the Medical Beauty & Personal Care solution page.
Sensing, Machine Vision and Industrial Detection
For sensing, machine-vision and industrial-detection applications, product selection should consider working distance, receiver sensitivity, driving conditions, beam divergence and overall system optical efficiency.
For further information about VCSEL integration in machine vision, near-infrared illumination and sensing systems, visit the Sensing & Machine Vision solution page.
5. Evaluation Kit and Documentation Support
The 808nm 5mW 3030 VCSEL SMD can be evaluated for PCB design validation, SMT assembly testing, driver-circuit evaluation and initial optical integration.
The Evaluation Kit includes:
- 10 pcs / KIT
- 808nm 5mW 3030 VCSEL SMD
- Corresponding product datasheet
- 3030 package-dimension document
- International shipping quoted according to destination
The following requirements can be discussed according to the project:
- Center wavelength
- Wavelength tolerance
- Optical output power
- Power-bin selection
- Pulse / QCW driving conditions
- Package and PCB integration requirements
- Volume-supply requirements
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
6. Frequently Asked Questions
FAQ 1. What are the main optical and electrical specifications of the 808nm 5mW 3030 VCSEL SMD?
The device uses a 3030 surface-mount package and provides a typical peak wavelength of 808nm within a wavelength range of 800–816nm.
Under a Pulse / QCW test condition of IF = 7mA, 25°C, 0.5ms pulse width and 1% duty cycle, the device provides 5.5mW typical optical output and 6mW maximum optical output.
The typical forward voltage is 2.0V, the typical threshold current is 2mA and the typical D86 beam divergence is 21°.
The final drive condition and system design should follow the product datasheet and the customer’s actual PCB and optical architecture.
FAQ 2. How should the 808nm 5mW 3030 VCSEL SMD be integrated onto a PCB?
The device can be used with automated SMT placement and reflow soldering. The PCB pads should be designed according to the corresponding 3030 package drawing.
The PCB design should confirm device polarity, pad dimensions, placement orientation, reflow conditions and the thermal structure around the package.
As the VCSEL is ESD-sensitive, appropriate electrostatic protection should be used during storage, handling, placement, soldering and testing.
The product operates in Pulse / QCW mode, and the driver circuit should follow the specified current, pulse-width and duty-cycle conditions.
FAQ 3. How should I choose between the 5mW 3030 and the 10mW or 20mW 2835 VCSEL SMD options?
The 808nm 5mW 3030 VCSEL SMD is intended for lower optical-output requirements and PCB layouts designed around a 3030 package.
The 808nm 10mW and 20mW VCSEL SMD products use 2835 packages and provide alternative options for projects requiring higher optical output from each device.
The final product should be selected according to target optical output, drive current, Pulse / QCW conditions, available PCB space, package dimensions and system optical requirements.