808nm
808nm VCSEL Bare Die Series
808nm VCSEL bare die series from low to high power for QCW, pulsed and CW operation in NIR sensing, machine vision, illumination and optical modules.
Specifications
- Product Type
- VCSEL Bare Die Series
- Wavelength
- 808 nm typ.
- Optical Output Power
- 5 mW to 60 W available
- Emitter Configuration
- Single-emitter / multi-emitter / VCSEL array die options
- Operating Mode
- QCW / Pulse / CW options
- Die Size
- 140 × 170μm to 5000 × 6000μm, model-dependent
- Recommended Assembly
- Wire bonding / ceramic submount / custom packaging
1. 808nm VCSEL Bare Die Supply for Packaging and Module Integration
The 808nm VCSEL Bare Die Series is designed for customers sourcing near-infrared VCSEL bare die for packaging and optical-source development. The series includes 808nm VCSEL chips, VCSEL laser chips and high-power VCSEL array bare die.
The available output-power classes range from 5mW to 60W, covering single-emitter devices, compact multi-emitter chips and high-power VCSEL arrays. Depending on the selected model, QCW, pulsed or CW operation is available. The applicable operating conditions should be confirmed in the corresponding product datasheet.
These 808nm multi-mode VCSEL devices are supplied as unpackaged bare die for die attach, gold wire bonding, ceramic-submount assembly, custom VCSEL packaging and optical-module integration.
The different output-power levels, emitter configurations, die dimensions and operating modes allow packaging companies and module-development teams to select a suitable model according to package space, target optical output, emitter layout, thermal path and optical-system requirements.
This series is intended for:
- OSAT semiconductor assembly and test providers
- VCSEL and laser-diode packaging companies
- SMD, TO-can and ceramic laser-package manufacturers
- Die-attach and gold wire-bonding engineering teams
- Ceramic-submount and COB integrators
- Laser-module and optoelectronic-module manufacturers
- Lens, collimation, diffuser and beam-shaping companies
- Laser-component, bare-die and optical-module distributors
- Technical sourcing and second-source development teams
As a VCSEL bare die supplier, 1ONELASER supports 808nm VCSEL packaging, ceramic-submount integration, high-power near-infrared optical-source development and custom optical-module projects.
The bare die can be integrated into custom SMD packages, TO-can packages, ceramic laser packages, ceramic-submount assemblies, COB light sources and application-specific optical modules. As unpackaged semiconductor chips, the devices require appropriate die attach, gold wire bonding, thermal design, package protection and optical integration before being used in a finished device or module.
2. 808nm VCSEL Bare Die Model Selection
The 808nm VCSEL Bare Die Series provides low-, medium- and high-power configurations for different packaging, driving, thermal and optical-integration requirements.
Model selection should consider:
- Required optical output power
- QCW, pulsed or CW operating mode
- Operating current, pulse width and duty cycle
- Emitter configuration
- Die dimensions and bond-pad structure
- Beam divergence
- Package thermal path
- Lens, diffuser and module architecture
Model | Representative Optical Output | Emitter Configuration | Test Condition | Wavelength | Beam Divergence | Die Size |
|---|---|---|---|---|---|---|
808nm 5mW | 5.5mW typ. | 1 emitter | IF = 7mA, 25°C, QCW, 0.5ms, 1% duty cycle | 808nm typ. | 21° typ. | 140 ± 10 × 170 ± 10μm |
808nm 20mW | 25mW typ. | 4 emitters | IF = 28mA, 25°C, QCW, 0.5ms, 10% duty cycle | 808nm typ. | 21° typ. | 170 ± 10 × 170 ± 10μm |
808nm 30mW | 38mW typ. | 6 emitters | IF = 42mA, 25°C, QCW, 0.5ms, 10% duty cycle | 808nm typ. | 21° typ. | 163 ± 10 × 185 ± 10μm |
808nm 70mW | 77mW typ. | 12 emitters | IF = 84mA, 25°C, QCW, 0.1ms, 10% duty cycle | 808nm typ. | 25° typ. | 455 ± 10 × 200 ± 10μm |
808nm 100mW | 120mW typ. | 22 emitters | IF = 140mA, 25°C, QCW, 0.1ms, 10% duty cycle | 808nm typ. | 25° typ. | 785 ± 10 × 200 ± 10μm |
808nm 200mW | 240mW typ. | 22 emitters | IF = 280mA, 25°C, QCW, 0.1ms, 10% duty cycle | 808nm typ. | 28° typ. | 895 ± 10 × 200 ± 10μm |
808nm 400mW | 440mW typ. | 22 emitters | IF = 500mA, 25°C, QCW, 0.1ms, 10% duty cycle | 808nm typ. | 33° typ. | 1005 ± 10 × 230 ± 10μm |
808nm 1.5W | 1.85W typ. | 280 emitters | IF = 2A, 25°C, QCW, 0.1ms, 3% duty cycle | 808nm typ. | 24° typ. | 855 ± 10 × 810 ± 10μm |
808nm 2W QCW | 2.3W typ. | 410 emitters | IF = 2.8A, 25°C, QCW, 0.1ms, 10% duty cycle | 808nm typ. | 25° typ. | 995 × 1020μm |
808nm 2W CW | 2.1W typ. | Multi-emitter array | IF = 2.2A, 20°C, CW | 808nm typ. | 22° typ. | 1080 ± 10 × 1050 ± 10μm |
808nm 3W | 3.6W typ. | 624 emitters | IF = 4A, 25°C, QCW, 0.5ms, 1% duty cycle | 808nm typ. | 21° typ. | 1075 ± 10 × 1120 ± 10μm |
808nm 8W | 8.2W typ. | 1958 emitters | IF = 10A, 25°C, QCW, 0.5ms, 1% duty cycle | 808nm typ. | 18° typ. | 2320 × 2290μm |
808nm 60W | 62W typ. | 8568 emitters | IF = 18A, 25°C, CW | 808nm typ. | 19° typ. | 5000 × 6000μm |
The values shown above are representative parameters from the current product specifications. Exact minimum, typical and maximum values, pulse conditions, temperature conditions and dimensional tolerances should be confirmed in the corresponding product datasheet.
The 808nm 3W and 8W Solid-Beam configurations belong to a separate solid-beam product series and are not included in this standard bare-die comparison table.
808nm 5mW, 20mW and 30mW VCSEL Bare Die
The 5mW, 20mW and 30mW models are compact 808nm VCSEL chips with single-emitter, four-emitter and six-emitter configurations.
These models are suitable for low-current VCSEL packaging, die-attach development, gold wire-bonding process verification, compact sensing sources, machine-vision support illumination and small near-infrared optical modules.
These products are primarily specified under QCW or pulsed conditions and should not be interpreted as continuous-wave devices.
808nm 70mW, 100mW, 200mW and 400mW VCSEL Bare Die
The 70mW to 400mW products use multi-emitter VCSEL array structures to provide increased optical output while maintaining relatively compact die dimensions.
These products can support machine vision, infrared illumination, industrial detection, consumer-electronics light sources and custom optical-module development.
The final model should be selected according to operating current, emitter dimensions, beam divergence, die size, package space and thermal-path requirements.
808nm 1.5W, 2W QCW, 2W CW and 3W VCSEL Bare Die
The 1.5W, 2W and 3W models provide high-power 808nm VCSEL bare die and multi-emitter array options for optical-source, package-structure and thermal-design evaluation.
The 1.5W, 2W QCW and standard 3W models are primarily specified under QCW or pulsed conditions. The 2W CW product is a separate configuration for projects requiring approximately 2W of continuous-wave optical output.
QCW and CW configurations should not be treated as interchangeable. Final selection should consider drive current, operating temperature, heatsink performance, package thermal resistance and complete system thermal design.
The standard 3W VCSEL bare die and the 808nm 3W Solid-Beam VCSEL Bare Die are different product configurations and should not be confused.
808nm 8W VCSEL Bare Die
The standard 808nm 8W VCSEL Bare Die is a high-power multi-emitter array specified under QCW operating conditions.
The product is suitable for high-power near-infrared optical-source development, ceramic-submount assembly, custom laser packaging, machine-vision illumination and equipment-level optical-module development.
Projects that use a solid spot or a specific far-field intensity distribution as a primary selection requirement should also evaluate the 808nm 8W Solid-Beam VCSEL Bare Die.
808nm 60W VCSEL Bare Die
The 808nm 60W VCSEL Bare Die is a high-power VCSEL array specified for CW operation at a heatsink temperature of 25°C.
Its 5000 × 6000μm die dimensions, 8568-emitter configuration and high operating current require an appropriate ceramic submount, current-delivery structure, die-attach process and low-thermal-resistance heat-dissipation path.
The product can support high-power near-infrared optical sources, industrial optical assemblies, medical beauty equipment light-source development and custom high-power VCSEL modules.
This product is supplied as a bare die and should not be described as a completed COB or packaged laser module.
3. Packaging, Optical Module and Application Development
OSAT and Custom VCSEL Packaging
The 808nm devices can be supplied as VCSEL bare die for gold wire-bonded ceramic-submount assemblies, custom SMD packages, TO-can packages, ceramic laser packages, COB assemblies and application-specific optical modules.
Packaging and integration directions include:
- VCSEL die attach
- Gold wire bonding
- Ceramic-submount assembly
- Custom VCSEL packaging
- Custom SMD laser packages
- TO-can laser packages
- Ceramic laser packages
- COB optical-source integration
- Multi-emitter VCSEL modules
- Application-specific high-power laser packages
The package structure should be selected according to optical output power, drive current, die area, bond-pad layout, heat generation, pulse conditions and the complete module architecture. High-power VCSEL arrays normally require substantially different current-delivery and thermal paths from low-power VCSEL chips.
Lens, Diffuser and Beam-Shaping Integration
This series can also support lens, diffuser, collimation and beam-shaping companies developing integrated 808nm optical-source assemblies.
Optical-integration directions include:
- Collimation-lens assemblies
- Beam-shaping optical components
- Diffuser-integrated light sources
- Lens-integrated VCSEL packages
- Homogenized near-infrared optical assemblies
- Application-specific far-field control
Projects requiring a centrally filled, solid or TEM00-like far-field intensity distribution should be evaluated through the separate 808nm Solid-Beam VCSEL Bare Die Series.
NIR Sensing, Machine Vision and Optical Module Development
The 808nm VCSEL Bare Die Series can support:
- Near-infrared sensing
- Machine-vision support illumination
- Infrared illumination
- Industrial optical detection
- Consumer-electronics light sources
- Engineering and research light sources
- High-power near-infrared optical-source development
- Custom optoelectronic modules
The final model should be selected according to optical output power, optical efficiency, beam divergence, pulse mode, thermal design and package dimensions.
For further evaluation of machine vision, infrared illumination and sensing-system applications, visit the Sensing & Machine Vision solution page.
Medical Beauty and Hair Removal Equipment Light-Source Development
Selected high-power 808nm VCSEL bare die can support downstream medical beauty equipment light-source development, handheld and floor-standing equipment sources, hair removal equipment optical assemblies and other high-power near-infrared module projects.
These applications require the VCSEL bare die to be integrated into an appropriate package, submount, thermal structure and optical system. The primary scope of this page remains bare-die supply, die attach, gold wire bonding, thermal integration and module development.
Hair removal equipment projects with specific solid-spot and far-field-distribution requirements should evaluate the 808nm 8W Solid-Beam VCSEL Bare Die.
For more information about integrating 808nm components into medical beauty and personal-care equipment, visit the Medical Beauty & Personal Care solution page.
Projects requiring a completed high-power packaged optical source can also evaluate the 808nm 66W VCSEL COB Module.
Distribution and Supply-Chain Support
The 808nm VCSEL Bare Die Series is also available to laser-component distributors, optical-module agents, technical sourcing companies, OEM purchasing teams and second-source development teams.
4. Evaluation Kit and Documentation Support
The 808nm VCSEL Bare Die Series can be evaluated for packaging trials, die-attach development, gold wire-bonding verification, driver testing and initial optical integration.
The Evaluation Kit includes:
- 10 pcs / KIT
- One selected model per kit
- Corresponding product datasheet
- Corresponding die-dimension document
- International shipping quoted according to destination
The following requirements can be discussed according to the project:
- Center wavelength
- Wavelength tolerance
- Optical output power
- Power-bin selection
- QCW or CW operating mode
- Emitter configuration
- Die dimensions
- Packaging and thermal path
- Lens, diffuser and optical integration
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
5. Frequently Asked Questions
FAQ 1. What output-power and operating-mode options are available for 808nm VCSEL bare die?
The series covers standard output-power classes from 5mW to 60W.
The low- and medium-power products include single-emitter and multi-emitter VCSEL chips that are primarily intended for QCW or pulsed operation. Higher-power configurations include 1.5W, 2W, 3W, 8W and 60W VCSEL arrays.
The 2W CW and 60W products are specified for continuous-wave operation under defined temperature and heatsink conditions. The other models are primarily specified under QCW or pulsed conditions.
The final selection should consider operating mode, pulse width, duty cycle, drive current, emitter count, die size, package thermal path and required optical distribution.
FAQ 2. What packaging and integration methods are suitable for 808nm VCSEL bare die?
The 808nm VCSEL bare die can be used for die attach, gold wire bonding, ceramic-submount assembly, custom SMD packages, TO-can packages, ceramic laser packages, COB integration and application-specific optical modules.
Low-power devices can be integrated into relatively compact packages. High-power arrays require stronger current-delivery paths, lower thermal resistance, suitable die-attach materials and corresponding heat-dissipation structures.
The bare die must be integrated using an appropriate electrical, mechanical, thermal and optical design before it can operate as part of a finished laser source or device.
FAQ 3. When should I choose standard 808nm VCSEL bare die, Solid-Beam bare die or an SMD package?
The standard 808nm VCSEL Bare Die Series is intended for customers requiring unpackaged VCSEL chips for their own die attach, gold wire bonding, submount, packaging and optical-module development.
The 808nm Solid-Beam VCSEL Bare Die Series is intended for projects that place greater emphasis on a centrally filled, solid, symmetrical or TEM00-like far-field intensity profile. Solid-Beam describes the far-field intensity profile and does not indicate a single-mode TEM00 laser specification.
The 808nm VCSEL SMD Series consists of completed surface-mount devices intended for SMT placement, reflow soldering and direct PCB integration.
The appropriate product form depends on whether the project requires maximum packaging flexibility, a specific far-field profile or a completed device for direct PCB assembly.
For completed packages intended for SMT placement, reflow soldering and PCB assembly, view the 808nm VCSEL SMD Series.