808nm 3W Solid-Beam VCSEL Bare Die
808nm 3W Solid-Beam VCSEL bare die with a 21° D86 divergence for compact handheld laser hair removal, NIR illumination and OEM module integration.
Specifications
- Product Type
- Multi-mode Solid-Beam VCSEL Bare Die
- Wavelength
- 808nm typical, 800–816nm
- Optical Output Power
- 3W typical, 2.6W minimum at 3.5A and 50°C
- Emitter Configuration
- 1,472 emitters
- Operating Mode
- QCW, 0.3ms pulse width, 1% duty cycle
- Die Size
- 1193 ± 20µm × 1210 ± 20µm × 100 ± 15µm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 808nm 3W Solid-Beam VCSEL Bare Die for Compact Module Integration
The 808nm 3W Solid-Beam VCSEL Bare Die is a multimode VCSEL laser chip developed for compact near-infrared optical modules that require QCW operation and a solid, symmetrical far-field profile. It provides 3W typical optical output power and 2.6W minimum output under the documented 3.5A, 50°C pulse test conditions.
With 1,472 emitters integrated into a 1193 ± 20µm × 1210 ± 20µm die, this configuration gives OEM engineers a smaller chip and lower operating-current option within the 808nm Solid-Beam VCSEL family. The documented 42% typical power conversion efficiency supports component evaluation where optical output, electrical input and thermal load must be balanced inside a compact module.
A typical application direction is component-level light-source development for handheld laser hair removal devices. The combination of 808nm output, compact die dimensions and a solid far-field profile can support downstream collimation, beam shaping, output-window development and laser power-density distribution evaluation inside portable beauty equipment.
The product can also be evaluated for machine vision, infrared illumination, consumer electronics and industrial optical systems. Final suitability depends on the customer’s package, driver, heat-sink structure, optical interfaces and operating conditions.
2. Optical Configuration and Packaging Direction
The following values describe the documented 3W configuration and its applicable QCW test conditions.
| Parameter | Documented Value | Integration Relevance |
|---|---|---|
| Optical Output Power | 3W typical, 2.6W minimum | Supports compact higher-output NIR source evaluation. |
| Operating Current | 3.5A typical | Defines the starting point for pulse-driver and interconnect design. |
| Power Conversion Efficiency | 42% typical at 50°C | Relevant to electrical input and module thermal-load evaluation. |
| Peak Wavelength | 808nm typical, 800–816nm | Supports model-level wavelength and optical-filter planning. |
| D86 Full Divergence | 21° typical, 18–24° | Used for downstream collimation, aperture and working-distance evaluation. |
| Emitter Configuration | 1,472 emitters | Provides a multi-emitter VCSEL array source within one bare die. |
| Die Size | 1193 ± 20µm × 1210 ± 20µm × 100 ± 15µm | Supports die-attach, bonding-pad and package-footprint planning. |
| Documented Test Conditions | QCW, 0.3ms pulse width, 1% duty cycle, 50°C heat-sink temperature | Customer validation must reproduce or deliberately adapt the relevant pulse and thermal conditions. |
The anode contact is located on the emission side with a gold surface, while the cathode contact is located on the gold-coated backside. Die attachment, wire bonding, heat spreading and optical packaging remain customer-defined.
The values above are component-level datasheet values. Optical output power, laser power density and power-density uniformity in the finished module depend on the package, driver, heat sink, optical window, working distance and beam-shaping system.
View the complete 808nm VCSEL Solid-Beam Series
3. Packaging, Optical Module and Application Development
Solid and Symmetrical Far-Field Integration
The documented 21° typical D86 full divergence is accompanied by a solid and symmetrical far-field profile. This beam characteristic gives optical engineers a more continuous source distribution for downstream collimation, homogenization and output-window design than a profile with a pronounced central low-intensity region.
For compact optical modules, the solid-beam profile can support effective aperture utilization and power-density distribution development. Actual optical power density and uniformity must be measured at the defined output plane of the completed package or module.
Compact Die Attach, Wire Bonding and Thermal Design
The 1193µm-class die and 3.5A typical operating current support evaluation in compact customer-defined packages. Assembly planning should address die-attach material, wire-bond current capacity, substrate thermal conductivity, heat-sink contact, optical-window clearance and ESD-safe handling.
The documented output values should not be treated as package-independent performance. Junction temperature, pulse-driver behavior, thermal resistance and optical-interface losses can change the measured module output.
For projects requiring broader package or module development, review the High-Power NIR Optical Modules solution.
Handheld Laser Hair Removal Device Development
A handheld laser hair removal device is a typical component-level application direction for the 808nm 3W Solid-Beam VCSEL Bare Die. The smaller die size and lower operating current make this configuration relevant to compact beauty handpieces and portable laser hair removal modules where package volume, driver size and thermal load are important engineering constraints.
The solid and symmetrical far-field profile can support downstream beam shaping and laser power-density distribution development across the intended output window. The completed device manufacturer must determine the required optical power density, exposure controls, working distance, cooling architecture and safety limits through full system design and validation.
This component does not establish hair-removal efficacy, clinical performance, finished-device safety, regulatory approval or certification.
Machine Vision and NIR Illumination Development
The same 808nm VCSEL bare die can be evaluated for machine vision, infrared illumination and industrial optical systems that require a compact multi-emitter NIR source. Detector sensitivity, optical filtering, modulation, working distance and environmental conditions must be evaluated at complete-system level.
For related system directions, see the Sensing and Machine Vision solution.
4. Evaluation Kit and Documentation Support
Evaluation planning for the 808nm 3W Solid-Beam VCSEL Bare Die should identify the intended package, pulse-driver conditions, heat-sink temperature, optical window, working distance and target output-plane requirements. Available technical discussions can cover datasheet interpretation, die handling, packaging direction, optical integration and project-specific evaluation requirements.
Request an 808nm 3W Solid-Beam VCSEL Bare Die Evaluation Kit
Submit a custom-development request
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
5. Frequently Asked Questions
FAQ 1. What are the QCW operating conditions for the 808nm 3W Solid-Beam VCSEL bare die?
The documented 3W typical output is measured at a 3.5A operating current with a 0.3ms pulse width, 1% duty cycle and 50°C heat-sink temperature. OEM engineers should validate output, wavelength, driver stability and thermal behavior under the actual package and operating conditions instead of treating the datasheet point as a universal module rating.
FAQ 2. Why is the solid and symmetrical far-field profile useful for compact handheld laser hair removal modules?
A solid and symmetrical far-field profile provides a more continuous source distribution for downstream collimation and beam shaping. In a compact handheld laser hair removal module, this can help engineers develop the output aperture and laser power-density distribution without relying on compensation for a pronounced central low-intensity region. Finished-module performance still requires optical simulation and measurement.
FAQ 3. Should an OEM project select the 3W or 8W 808nm Solid-Beam VCSEL configuration?
Select the 3W configuration when smaller die dimensions, lower operating current and compact module integration are priorities. Consider the 8W configuration when the project requires a higher output class and can support the corresponding driver, heat-sink and package requirements. Both options require model-specific optical, electrical and thermal validation.