808nm
808nm 5mW / 10mW / 20mW VCSEL SMD Series
Explore 808nm 5mW, 10mW and 20mW multimode VCSEL SMDs in 3030 and 2835 packages for QCW operation, PCB integration and compact NIR system design.
Specifications
- Product Type
- VCSEL SMD
- Wavelength
- 808nm typ.
- Optical Output Power
- 5mW / 10mW / 20mW
- Transverse Mode
- Multi-mode VCSEL
- Operating Mode
- Pulse / QCW
- Beam Divergence
- 21° typ. (18–24°)
- SMD Package Options
- 2835 / 3030
1. 808nm 5mW / 10mW / 20mW VCSEL SMD Series for PCB Integration
The 808nm 5mW / 10mW / 20mW VCSEL SMD Series provides three discrete multimode near-infrared optical-output configurations for surface-mount assembly, PCB integration and compact OEM optical-module development.
The series includes a 5mW VCSEL in a 3030 SMD package and 10mW and 20mW VCSEL options in 2835 SMD packages. These are fixed product configurations rather than a continuous 5mW-to-20mW power range.
All three configurations operate at a typical wavelength of 808nm and are specified for pulse or QCW operation according to the corresponding product datasheet. Their surface-mount format provides an integration path for customers requiring completed SMD laser components instead of unpackaged VCSEL bare die.
The three power options allow PCB and optical-system developers to select a suitable configuration according to target optical output, package footprint, operating current, thermal path and downstream optical requirements.
Typical customer and development directions include:
- PCB-mounted near-infrared optical sources
- Compact sensing and detection modules
- Machine-vision support illumination
- Optical alignment and measurement systems
- Consumer-electronics optical assemblies
- OEM optoelectronic modules
- Automated SMD assembly and production evaluation
- Alternative-source and supply-chain development
Customers requiring chip-level die attach, wire bonding or custom package development can also review the 808nm VCSEL Bare Die Series.
2. Core Optical Characteristics and SMD Package Options
The following values summarize the three available configurations. Electrical and optical parameters must be evaluated under the test conditions stated in the corresponding product datasheet.
Configuration | SMD Package | Representative Optical Output | Forward Current | Operating Condition | Beam Divergence |
|---|---|---|---|---|---|
3030 PCT | 5.5mW typ.; 6mW max. | 7mA | 25°C, QCW, 0.5ms pulse width, 1% duty cycle | 21° typ. | |
2835 PCT | 10mW typ.; 15mW max. | 15mA | 25°C, QCW, 0.5ms pulse width, 10% duty cycle | 21° typ. | |
2835 PCT | 20mW typ.; 25mW max. | 28mA | 25°C, QCW, 0.5ms pulse width, 10% duty cycle | 21° typ. |
All three products use a typical 808nm wavelength with an 800–816nm specified range. The values shown above are representative parameters, and the exact minimum, typical and maximum values should be confirmed in the corresponding datasheet.
Package Selection
The 3030 package is used for the 5mW configuration and provides a compact surface-mount format for low-current 808nm optical-source integration.
The 2835 package is used for the 10mW and 20mW configurations. These two products share the same nominal package format but use different operating currents and optical-output classes.
Package selection should consider:
- Required optical output power
- PCB footprint and component height
- Operating current
- Pulse width and duty cycle
- Pad design and polarity
- Thermal path
- Optical-axis position
- Downstream lens or window
- Automated placement and production requirements
PCB and SMT Integration
The SMD configuration is intended for surface-mount production and direct PCB integration. The customer should confirm the recommended pad layout, component polarity, soldering conditions, reflow profile and board-level thermal design before production.
The complete PCB assembly should be evaluated for:
- Electrical drive stability
- Pulse-current control
- Local heat accumulation
- Package alignment
- Optical clearance
- Lens or window placement
- Mechanical tolerance
- Production-process repeatability
The published component values do not replace validation in the customer’s actual PCB, driver, enclosure and optical system.
3. Applications
NIR Sensing and Detection
The 808nm 5mW, 10mW and 20mW VCSEL SMD options can support component-level development of compact near-infrared sensing and detection systems.
Possible directions include:
- Photoelectric sensing
- Object detection
- Position and proximity sensing
- Optical alignment
- Reflective measurement
- Industrial detection
- Machine-vision support illumination
- Engineering and research optical sources
The appropriate power option depends on detector sensitivity, working distance, optical path, target reflectivity, ambient-light conditions and system-level signal requirements.
Beauty and Personal-Care Equipment Light-Source Development
The 808nm 5mW, 10mW and 20mW VCSEL SMD options can support compact beauty equipment, wearable personal-care products and multi-wavelength PCB optical-source development.
Compact PCB-Mounted Optical Sources
The completed SMD format can support compact PCB-mounted near-infrared optical sources for OEM modules, consumer-electronics assemblies, measurement equipment and application-specific optoelectronic systems.
Compared with unpackaged bare die, an SMD component reduces the customer’s need to establish a separate die-attach and wire-bonding process. The customer remains responsible for board-level electrical design, thermal management, soldering-process validation, optical alignment and complete-system testing.
Product-Form Selection
Choose the 808nm VCSEL SMD Series when the project requires a completed surface-mount component for SMT assembly and direct PCB integration.
Choose the 808nm VCSEL Bare Die Series when the project requires unpackaged VCSEL chips for custom die attach, wire bonding, submount assembly or package development.
These application descriptions represent component-level development possibilities. They do not establish finished-device performance, safety classification, regulatory approval or suitability for a particular end product.
4. Evaluation Kit and Documentation Support
Evaluation samples can be discussed for PCB-layout verification, driver testing, pulse-control evaluation, soldering-process development, optical alignment and initial system integration.
The selected configuration should be evaluated under the intended operating current, pulse width, duty cycle, PCB thermal path and ambient-temperature conditions.
Project-specific requirements can include:
- 5mW, 10mW or 20mW optical-output selection
- 3030 or 2835 package selection
- Wavelength tolerance
- Pulse and QCW operating conditions
- PCB pad and polarity review
- Driver and current-control evaluation
- Optical-window and lens integration
- Packaging and supply planning
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer's finished device.
5. Frequently Asked Questions
FAQ 1. What is the difference between the 808nm 5mW, 10mW and 20mW VCSEL SMD options?
The 5mW configuration uses a 3030 SMD package and is specified at a lower operating current for compact, low-power PCB-mounted optical-source development.
The 10mW and 20mW configurations use 2835 SMD packages. The 10mW option is specified at 15mA, while the 20mW option is specified at 28mA under the corresponding QCW test conditions.
Final selection should consider required optical output, detector sensitivity, working distance, PCB space, driver capability, pulse conditions and thermal design rather than power rating alone.
FAQ 2. Can the 808nm VCSEL SMD products be assembled directly onto a PCB?
The products are supplied in surface-mount packages for PCB and SMT integration. The customer should still confirm the correct pad layout, polarity, soldering process, reflow conditions, optical clearance and board-level thermal path.
Production qualification should be completed using the actual PCB material, driver circuit, assembly process and operating condition. A suitable surface-mount package does not eliminate the need for electrical, thermal and optical validation.
FAQ 3. How should I select an 808nm VCSEL SMD for sensing or compact NIR system development?
Selection should begin with the required optical output and working distance. The 5mW configuration can be evaluated for lower-current compact optical sources, while the 10mW and 20mW configurations provide progressively higher output in 2835 packages.
The final choice should also consider detector responsivity, target reflectivity, ambient light, pulse width, duty cycle, PCB thermal behavior, package footprint and downstream optics. Testing under the intended system condition is required before production selection.
