808nm 8W Solid-Beam VCSEL Bare Die
808nm 8W Solid-Beam VCSEL bare die with an 18° D86 divergence for higher-output handheld laser hair removal and high-power NIR module integration.
Specifications
- Product Type
- Multi-mode Solid-Beam VCSEL Bare Die
- Wavelength
- 808nm typical, 800–816nm
- Optical Output Power
- 8.2W typical, 7.2W minimum at 10A and 50°C
- Emitter Configuration
- 5,600 emitters
- Operating Mode
- QCW, 0.3ms pulse width, 1% duty cycle
- Die Size
- 2320µm × 2290µm × 100 ± 15µm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 808nm 8W Solid-Beam VCSEL Bare Die for Higher-Output NIR Module Integration
The 808nm 8W Solid-Beam VCSEL Bare Die is a multimode, multi-emitter VCSEL laser chip developed for higher-output near-infrared optical modules. It provides 8.2W typical optical output power and 7.2W minimum output under the documented 10A, 50°C QCW test conditions.
The die integrates 5,600 emitters within a 2320µm × 2290µm footprint and provides a solid, symmetrical far-field profile with an 18° typical D86 full divergence. This configuration is intended for projects that require higher optical output together with controlled downstream collimation, beam shaping and output-window development.
A typical application direction is component-level light-source development for handheld laser hair removal devices. Compared with the 3W Solid-Beam configuration, the 8W option provides a higher output class but requires greater attention to pulse-driver capability, current handling, package thermal resistance and heat-sink design.
The product can also support high-power NIR illumination, machine vision, consumer electronics and industrial optical-system evaluation. Final suitability must be validated using the intended package, driver, thermal path and optical architecture.
2. Optical Configuration and Packaging Direction
The following values describe the documented 8W Solid-Beam configuration.
| Parameter | Documented Value | Integration Relevance |
|---|---|---|
| Optical Output Power | 8.2W typical, 7.2W minimum | Supports higher-output NIR module and optical-engine evaluation. |
| Operating Current | 10A typical | Requires appropriate pulse-driver, interconnect and bonding-current capacity. |
| Power Conversion Efficiency | 40% typical at 50°C | Relevant to electrical-input, package-loss and thermal-load planning. |
| Peak Wavelength | 808nm typical, 800–816nm | Supports wavelength-specific optical and filtering design. |
| D86 Full Divergence | 18° typical, 15–21° | Supports downstream collimation, aperture and beam-shaping evaluation. |
| Emitter Configuration | 5,600 emitters | Provides a high-density multi-emitter VCSEL array source. |
| Die Size | 2320µm × 2290µm × 100 ± 15µm | Defines package footprint, bonding geometry and thermal-contact requirements. |
| Documented Test Conditions | QCW, 0.3ms pulse width, 1% duty cycle, 50°C heat-sink temperature | Module output must be validated under the intended pulse and thermal conditions. |
The emission-side anode and backside cathode use gold contact surfaces. The customer or packaging partner remains responsible for die attachment, wire bonding, substrate selection, heat spreading and optical-interface development.
The documented 8.2W value is optical output power at the specified test point. It is not a finished-device laser power-density rating. Module-level power density and power-density uniformity depend on the optical window, beam-shaping elements, working distance and measured output area.
View the complete 808nm VCSEL Solid-Beam Series
Compare the standard 808nm 8W VCSEL Bare Die
3. Packaging, Optical Module and Application Development
High-Density Emitter Array and Solid Far-Field Profile
The 5,600-emitter array produces a solid and symmetrical far-field profile with an 18° typical D86 full divergence. This optical configuration provides a more continuous source distribution for downstream collimation and beam shaping than a profile with a pronounced central low-intensity region.
For higher-output modules, the solid-beam profile can support effective aperture utilization and laser power-density distribution development. The finished package or module must still be measured at the intended output plane to verify optical power, power-density uniformity and working-distance performance.
Driver, Heat-Sink and Package Integration
The 10A typical operating current requires an appropriate QCW pulse driver, low-resistance current path, wire-bond capacity and thermal interface. Package design should control die-attach quality, substrate thermal resistance, heat-sink contact and optical-window clearance.
Although the datasheet records 40% typical power conversion efficiency at 50°C, the customer must validate junction-temperature behavior, driver losses, pulse stability and module heat removal under the intended operating cycle.
For package and module development directions, review the High-Power NIR Optical Modules solution.
Higher-Output Handheld Laser Hair Removal Device Development
The 808nm 8W Solid-Beam VCSEL Bare Die is particularly relevant to component-level light-source development for handheld laser hair removal devices that require a higher optical-output class. Its solid and symmetrical far-field profile can support downstream collimation, optical-window utilization and power-density distribution development inside a compact beauty handpiece.
The higher output and 10A operating-current level require the finished-device developer to coordinate the driver, heat sink, cooling architecture, optical window, exposure controls and safety interlocks as one complete system.
This product is a semiconductor laser component. It does not establish hair-removal efficacy, clinical performance, finished-device safety, regulatory approval or certification.
High-Power NIR Illumination and Industrial Development
The 8W Solid-Beam VCSEL can also be evaluated for higher-output NIR illumination, machine vision and industrial optical systems. Project evaluation should consider detector response, optical filtering, working distance, modulation, environmental conditions and permitted exposure levels.
For related sensing and illumination directions, see the Sensing and Machine Vision solution.
4. Evaluation Kit and Documentation Support
Evaluation planning for the 808nm 8W Solid-Beam VCSEL Bare Die should define the target package, 10A-class pulse-driver architecture, heat-sink temperature, die-attach process, optical window, working distance and output-plane measurement requirements. Technical discussions can cover datasheet interpretation, packaging direction, thermal planning, optical integration and model comparison.
Request an 808nm 8W Solid-Beam VCSEL Bare Die Evaluation Kit
Submit a custom-development request
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
5. Frequently Asked Questions
FAQ 1. What driver and thermal conditions should be evaluated for the 808nm 8W Solid-Beam VCSEL bare die?
The documented 8.2W typical output is measured at 10A with a 0.3ms pulse width, 1% duty cycle and 50°C heat-sink temperature. The customer should validate pulse-current stability, wire-bond capacity, voltage drop, package thermal resistance, junction-temperature behavior and heat-sink performance under the intended operating cycle.
FAQ 2. How does the 18° D86 solid far-field profile support handheld laser hair removal optical design?
The solid and symmetrical far-field profile provides a more continuous source distribution for downstream collimation, beam shaping and output-window development. In a handheld laser hair removal module, this can support effective aperture utilization and laser power-density distribution development. The completed device still requires optical simulation, output-plane measurement and safety validation.
FAQ 3. How does the 8W Solid-Beam VCSEL differ from the standard 8W bare die and the 3W Solid-Beam configuration?
The 8W Solid-Beam configuration is selected when the project requires a solid far-field profile together with a higher output class. The 3W Solid-Beam option uses a smaller die and lower operating current for more compact integration. The standard 8W bare die is a separate product path and should be compared using its own beam-profile, emitter-layout, package and test-condition documentation rather than treated as the same configuration.
Compare the 808nm 3W Solid-Beam VCSEL Bare Die