665nm
665nm 3mW VCSEL Bare Die
665nm 3mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and red VCSEL chip integration.
Specifications
- Product Type
- Multi-mode VCSEL Bare Die
- Wavelength
- 665 nm typ.
- Optical Output Power
- 3mW class, 3.0mW typ. @ IF = 10mA
- Emitter Configuration
- Single Emitter
- Operating Mode
- QCW, 0.5ms Pulse Width, 1% Duty Cycle
- Die Size
- 200±10 μm × 200±10 μm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 665nm 3mW VCSEL Bare Die for Packaging and Module Integration
The 665nm 3mW VCSEL Bare Die is a compact, low-output, 1-emitter, multi-mode visible-red VCSEL chip and red VCSEL laser chip developed for chip-level packaging, die attach, gold-wire bonding, ceramic-submount assembly and custom VCSEL packaging.
This low-power red VCSEL die provides 3.0mW typ. optical output under a 10mA, 25°C QCW test condition. Its 200μm × 200μm square footprint and compact single-emitter layout support early-stage packaging validation, wire-bonding process verification and compact visible-red optical-module development.
This 665nm VCSEL chip is intended for:
- OSAT semiconductor assembly and test providers
- VCSEL and laser-diode packaging companies
- SMD, TO-can and ceramic package developers
- Die-attach and wire-bonding engineering teams
- Ceramic-submount and COB integrators
- Laser-module and optoelectronic-module manufacturers
- Lens, collimation and beam-shaping companies involved in laser-source integration
- Laser bare-die, component and optical-module distributors
- Technical sourcing and second-source development teams
The VCSEL die can be integrated into custom SMD packages, TO-can packages, ceramic packages, ceramic-submount assemblies and compact optical modules. As an unpackaged semiconductor chip, it requires suitable mounting, bonding, thermal-path, package-design and optical-integration processes before use in a finished device or module.
2. Optical Configuration and Packaging Direction
The 665nm 3mW VCSEL chip uses a compact low-output, multi-mode structure for visible-red optical-source packaging and early-stage packaging-process development.
Parameter | Value |
|---|---|
Optical Output Power | 2.0mW min. / 3.0mW typ. @ IF = 10mA |
Center Wavelength | 665nm typ. |
Wavelength Range | 663nm min. / 665nm typ. |
Threshold Current | 2.8mA typ. |
Forward Voltage | 2.5V typ. @ IF = 10mA |
Slope Efficiency | 0.3W/A min. / 0.4W/A typ. |
Power Conversion Efficiency | 14% typ. @ IF = 10mA |
Beam Divergence | 21° typ. @ IF = 10mA |
Operating Condition | QCW, 0.5ms pulse width, 1% duty cycle |
Die Size | 200μm × 200μm |
Die Thickness | 130μm |
Bond Pad Size | 90μm × 90μm |
The device can be supplied as VCSEL die for packaging in:
- Die-attach process development
- Gold-wire bonding verification
- Wire-bonded ceramic-submount assemblies
- Chip-on-submount assembly
- Custom SMD laser packages
- TO-can and ceramic packages
- Compact visible-red optical modules
- Lens and beam-shaping optical assemblies
Compared with the 665nm 7mW, 8mW and 9mW models, the 3mW device is positioned as the compact low-output option for customers requiring a simpler red VCSEL chip for die attach, wire bonding, package-process validation and early-stage module integration.
3. Packaging, Optical Module and Application Development
OSAT and Custom Laser Packaging
The 665nm 3mW bare die supports wire-bonding VCSEL projects, ceramic-submount assembly and application-specific laser-device development.
Packaging directions include:
- VCSEL die attach
- Gold-wire bonding process verification
- Custom VCSEL packaging
- Custom SMD laser packages
- TO-can laser packages
- Ceramic laser packages
- Ceramic-submount optical sources
- Chip-on-submount assembly
- Compact COB and optical modules
- Compact visible-red VCSEL source packages
The compact single-emitter layout makes this model suitable for packaging teams that need a lower-output 665nm red VCSEL die for process validation before moving to higher-output 4-emitter or 6-emitter devices.
Lens and Optical Module Integration
The device can support lens, collimation and beam-shaping companies developing compact visible-red laser-source assemblies.
Possible integration directions include:
- Collimation-lens assemblies
- Beam-shaping optical components
- Diffuser-integrated modules
- Lens-integrated VCSEL sources
- Compact visible-red optical modules
- Low-output red VCSEL source modules
- Early-stage optical-module validation
For projects requiring a 665nm visible-red light source, this device can be used as a bare-die red VCSEL chip option for packaging, collimation, diffusion, beam shaping and optical-module development.
Downstream Application Development
The datasheet identifies sensor light sources, consumer electronic products, machine vision and red lighting as application directions.
The device can also support:
- Compact visible-red laser modules
- Alignment and indication sources
- Optical sensor light sources
- Engineering and research light sources
- Machine-vision support illumination
- Beauty and personal-care prototypes
- Photobiomodulation-related optical development
- Hair-growth and scalp-light device development
These are downstream directions after the VCSEL bare die has been integrated into an appropriate package or optical module. The primary focus of this page remains bare-die supply, die attach, gold-wire bonding, custom VCSEL packaging and module integration.
The product is also available to laser-component agents, module distributors and second-source development teams supporting customer packaging and integration projects.
4. Evaluation Kit and Documentation Support
The 665nm 3mW VCSEL Bare Die is available as an Evaluation Kit for packaging trials, die-attach development, gold-wire bonding verification and initial optical integration.
- 10 pcs / KIT
- Product datasheet and die-dimension documentation
- International shipping quoted according to destination
- Center wavelength, wavelength tolerance, optical output power, power-bin selection and package-integration requirements can be discussed
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
5. Frequently Asked Questions
FAQ 1. What packaging methods are suitable for the 665nm 3mW VCSEL Bare Die?
The device can be used for die attach, gold-wire bonding, ceramic-submount assembly, chip-on-submount assembly, custom SMD packages, TO-can packages, ceramic packages and compact optical-module integration.
As an unpackaged die, it must be integrated using an appropriate mounting, bonding, thermal-path, package-design and optical-integration process.
FAQ 2. What is the positioning of the 665nm 3mW VCSEL Bare Die within the 665nm Bare Die Series?
The 665nm 3mW model is the compact 1-emitter, low-output option in the 665nm VCSEL Bare Die Series.
It is suitable for early-stage packaging validation, low-power visible-red source development, die-attach process evaluation, wire-bonding verification and compact optical-module development. Customers requiring higher output can evaluate the 665nm 7mW, 8mW or 9mW models.
FAQ 3. Can the wavelength, optical output, power bin or package configuration be customized?
Center wavelength, wavelength tolerance, optical output, power-bin selection and package-integration requirements can be discussed according to the project.
Projects requiring different output levels or emitter layouts can select from the 665nm 3mW, 7mW, 8mW and 9mW VCSEL Bare Die models or submit a custom-development request.