665nm
665nm 3/7/8/9mW VCSEL Bare Die Series
665nm 3/7/8/9mW VCSEL Bare Die Series for wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.
Specifications
- Product Type
- Multi-mode VCSEL Bare Die
- Wavelength
- 665 nm typ.
- Optical Output Power
- 3mW / 7mW / 8mW / 9mW class
- Emitter Configuration
- Single / 4 / 6 Emitters
- Operating Mode
- QCW, 0.5ms Pulse Width, 1% Duty Cycle
- Die Size
- 200μm × 200μm / 170±10μm × 170±10μm / 163±10μm × 185±10μm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 665nm VCSEL Bare Die Supply for Packaging and Module Integration
The 665nm 3/7/8/9mW VCSEL Bare Die Series includes 665nm VCSEL chip and VCSEL laser chip options for customers sourcing visible-red bare die for packaging. The series covers 3mW, 7mW, 8mW and 9mW models with compact single-emitter, 4-emitter and 6-emitter layout options.
These 665nm pulse VCSEL devices use a multi-mode structure and are supplied as unpackaged dies for die attach, gold-wire bonding, ceramic-submount assembly and custom VCSEL packaging.
The different optical-output levels, emitter configurations and die dimensions allow packaging companies and module-development teams to select a suitable model according to package space, target output, emitter layout, drive-current condition and optical-module requirements.
The series is intended for:
- OSAT semiconductor assembly and test providers
- VCSEL and laser-diode packaging companies
- SMD, TO-can and ceramic laser-package manufacturers
- Die-attach and wire-bonding engineering teams
- Ceramic-submount and COB integrators
- Laser-module and optoelectronic-module manufacturers
- Lens, collimation and beam-shaping companies involved in laser-source integration
- Laser-component, bare-die and optical-module distributors
- Technical sourcing and second-source development teams
As a VCSEL bare die supplier, 1ONELASER supports OSAT VCSEL packaging, laser-diode packaging, ceramic-submount integration and custom optical-module development.
The bare die can be integrated into custom SMD packages, TO-can packages, ceramic packages, ceramic-submount assemblies and compact optical modules. As unpackaged semiconductor chips, the devices require suitable mounting, wire bonding, package design and optical integration before use in a finished device or module.
2. 3mW, 7mW, 8mW and 9mW Model Selection
The series includes one compact low-output VCSEL die, two 4-emitter medium-output VCSEL die options and one 6-emitter higher-output VCSEL die option, allowing customers to compare emitter count, die footprint, optical output and drive-current condition within the same 665nm product family.
Model | Optical Output Power | Emitter Configuration | Test Condition | Wavelength | Beam Divergence | Die Size |
|---|---|---|---|---|---|---|
665nm 3mW | 2.0–3.0mW, 3.0mW typ. | Compact single-emitter layout | 10mA, 25°C, QCW | 663–665nm | 21° typ. | 200μm × 200μm |
665nm 7mW | 5.0–7.0mW, 7.0mW typ. | 4 Emitters | 18mA, 25°C, QCW | 661–669nm | 21° typ. | 170±10μm × 170±10μm |
665nm 8mW | 6.0–8.0mW, 8.0mW typ. | 4 Emitters | 15mA, 25°C, QCW | 660–670nm | 22° typ. | 170±10μm × 170±10μm |
665nm 9mW | 7.0–9.0mW, 9.0mW typ. | 6 Emitters | 25mA, 25°C, QCW | 661–669nm | 22° typ. | 163±10μm × 185±10μm |
The four models are specified under QCW conditions with a 0.5ms pulse width and 1% duty cycle. They produce a symmetrical annular, doughnut-shaped far-field profile.
665nm 3mW VCSEL Bare Die
The 665nm 3mW VCSEL chip is a compact low-output bare die with a 200μm × 200μm footprint.
It is suitable for low-power visible-red source packaging, initial VCSEL die-attach development, wire-bonding process verification and compact optical-module evaluation.
This low-output red VCSEL die is intended for projects requiring a simple emitter layout, relatively low drive current and compact chip-level integration.
665nm 7mW VCSEL Bare Die
The 665nm 7mW VCSEL chip uses a 4-emitter layout within a compact 170±10μm × 170±10μm die.
It provides medium-output optical performance under an 18mA test condition and is suitable for 4-emitter VCSEL packaging, ceramic-submount integration, custom SMD laser packages and visible-red optical modules.
This model is positioned for projects requiring higher output than the 3mW model while maintaining a square die footprint and moderate multi-emitter layout complexity.
665nm 8mW VCSEL Bare Die
The 665nm 8mW VCSEL chip also uses a 4-emitter layout within a 170±10μm × 170±10μm die.
Compared with the 7mW model, the 8mW device is positioned as a higher-output 4-emitter option under a 15mA test condition. It is suitable for medium-output red VCSEL modules, custom ceramic packages, custom SMD package development and optical-source packaging projects requiring a balance between output power, die size and emitter count.
665nm 9mW VCSEL Bare Die
The 665nm 9mW VCSEL chip uses six emitters in a compact, non-square die measuring 163±10μm × 185±10μm.
This six-emitter 665nm VCSEL provides higher optical output under a 25mA test condition and is suitable for compact multi-emitter VCSEL packaging, higher-output visible-red modules, ceramic-submount integration and custom laser packages requiring increased emitter density.
3. Packaging, Optical Module and Application Development
OSAT and Custom VCSEL Packaging
The devices can be supplied as VCSEL die for packaging in wire-bonded ceramic-submount assemblies, custom SMD packages, TO-can packages, ceramic laser packages and application-specific optical modules.
Packaging and integration directions include:
- VCSEL die attach
- Gold-wire bonding
- Ceramic-submount assembly
- Custom VCSEL packaging
- Custom SMD laser packages
- TO-can laser packages
- Ceramic laser packages
- COB and compact optical-source modules
- Multi-emitter VCSEL modules
- Application-specific laser-device packages
The range of output powers and emitter configurations allows packaging companies to select a device according to package dimensions, bond-pad layout, optical-output requirements, drive-current condition and module structure.
Lens and Beam-Shaping Integration
The series can also support optical lens, collimation and beam-shaping companies developing integrated laser-source assemblies.
Possible integration directions include:
- Collimation-lens assemblies
- Beam-shaping optical components
- Diffuser-integrated modules
- Lens-integrated VCSEL sources
- Compact visible-red optical assemblies
- 4-emitter and 6-emitter red VCSEL source modules
- Higher-output red-light optical modules
The 3mW, 7mW, 8mW and 9mW models allow engineering teams to compare emitter layouts, far-field distribution, lens dimensions and module configurations within the same 665nm visible-red VCSEL chip family.
Laser and Optical Module Development
The 665nm red VCSEL bare die series can be used in:
- Visible-red laser modules
- Sensor light sources
- Consumer-electronics light sources
- Machine-vision support illumination
- Alignment and indication systems
- Engineering and research light sources
- Custom optoelectronic modules
The corresponding datasheets identify sensor light sources, consumer electronics, machine vision and red lighting as application directions.
Medical Beauty and Red-Light Product Development
The series can also support beauty and personal-care prototypes, photobiomodulation-related optical development, hair-growth and scalp-light devices, and other projects requiring a 665nm visible-red source.
These are downstream applications after the VCSEL bare die has been integrated into an appropriate package or optical module. The primary focus of this page remains bare-die supply, packaging, wire bonding and module integration.
Distribution and Supply-Chain Support
The 665nm VCSEL Bare Die Series is also available to laser-component distributors, optical-module agents, technical sourcing companies and second-source development teams supporting customer packaging and integration projects.
4. Evaluation Kit and Documentation Support
The 665nm VCSEL Bare Die Series is available as an Evaluation Kit for packaging trials, die-attach development, wire-bonding verification and initial optical integration.
- 10 pcs / KIT
- One selected model per kit: 3mW, 7mW, 8mW or 9mW
- Corresponding product datasheet and die-dimension documentation
- International shipping quoted according to destination
- Center wavelength, wavelength tolerance, optical output power, power-bin selection and emitter-configuration requirements can be discussed
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
5. Frequently Asked Questions
FAQ 1. What is the difference between the 3mW, 7mW, 8mW and 9mW 665nm VCSEL bare die models?
The main differences are optical output power, emitter count, die dimensions and test current.
- The 3mW VCSEL chip uses a compact single-emitter layout and a 200μm × 200μm die for low-output packaging validation.
- The 7mW VCSEL chip uses four emitters in a 170±10μm × 170±10μm die for medium-output multi-emitter modules.
- The 8mW VCSEL chip also uses four emitters in a 170±10μm × 170±10μm die and is positioned as a higher-output 4-emitter option.
- The 9mW VCSEL chip uses six emitters in a 163±10μm × 185±10μm die for higher-output, compact multi-emitter packaging.
The appropriate model depends on the target optical output, available die space, emitter layout, package structure, drive-current condition and module-integration requirements.
FAQ 2. What packaging methods are suitable for the 665nm VCSEL Bare Die Series?
The series can be used for VCSEL die attach, gold-wire bonding, ceramic-submount assembly, custom SMD packages, TO-can packages, ceramic packages and compact optical-module integration.
The unpackaged die must be integrated using an appropriate mounting, bonding, thermal-path and package design. 1ONELASER can discuss bare-die supply, power-bin selection, emitter configuration and custom VCSEL packaging according to project requirements.
FAQ 3. How is the 665nm VCSEL Bare Die Series different from the 665nm VCSEL SMD Series?
The 665nm VCSEL Bare Die Series supplies unpackaged VCSEL chips for OSAT providers, laser-packaging companies, die-attach and wire-bonding teams, ceramic-submount integrators and optical-module manufacturers.
The 665nm VCSEL SMD Series consists of completed surface-mount devices intended for SMT placement, reflow soldering and direct PCB integration.
For customers developing finished PCB-level light-source products, SMD packages may be more suitable. For customers developing their own package, ceramic submount, TO-can device, optical module or customized laser-source structure, the VCSEL Bare Die Series is the more flexible option.