665nm
665nm 8mW VCSEL Bare Die
665nm 8mW multi-mode VCSEL bare die with four emitters, 170 × 170μm die size and QCW output at 15mA for wire bonding and custom red laser packaging.
Specifications
- Product Type
- Multi-mode VCSEL Bare Die
- Wavelength
- 665 nm typ.
- Optical Output Power
- 8mW class, 8.0mW typ. @ IF = 15mA
- Emitter Configuration
- 4 Emitters
- Operating Mode
- QCW, 0.5ms Pulse Width, 1% Duty Cycle
- Die Size
- 170±10 μm × 170±10 μm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 665nm 8mW VCSEL Bare Die for Packaging and Module Integration
The 665nm 8mW VCSEL Bare Die is a four-emitter, multi-mode visible-red VCSEL chip developed for customers building their own laser package or optical module. It combines an 8mW-class output point with a 170±10μm × 170±10μm square die for die attach, wire bonding, ceramic-submount assembly and custom package development.
Under the datasheet condition of 25°C, QCW operation, 0.5ms pulse width and 1% duty cycle, the device provides 6.0mW minimum and 8.0mW typical optical output at 15mA. The die contains four emitters, is 130±10μm thick and uses a 87±3μm × 85±3μm bond pad. These dimensions allow packaging and sourcing teams to compare it directly with other 665nm four-emitter die options while keeping each model’s electrical test point separate.
Typical evaluation audiences include:
- VCSEL package manufacturers seeking an 8mW-class visible-red die
- OSAT engineers planning four-emitter die attach and wire bonding
- Module teams comparing 7mW and 8mW choices within one die-size class
- Ceramic-submount and TO-can developers defining a 665nm optical source
- Procurement and second-source teams that require documented die geometry and QCW conditions
The component is supplied as bare die, not as a completed surface-mount device or finished laser module. Package construction, thermal control, electrical protection, optical alignment and final performance qualification remain part of the customer’s integration work.
2. Optical Configuration and Packaging Direction
The 665nm 8mW VCSEL Bare Die uses the same stated die outline and emitter count as the adjacent 7mW option, but its output is characterized at a different current. The exact datasheet values below should remain together with their test conditions during selection.
Parameter | Datasheet Value |
|---|---|
Optical Output Power | 6.0mW min. / 8.0mW typ. @ IF = 15mA |
Wavelength | 660nm min. / 665nm typ. / 670nm max. |
Threshold Current | 3.5mA min. / 4.5mA typ. |
Forward Voltage | 2.2V min. / 2.4V typ. @ IF = 15mA |
Operating Condition | QCW, 0.5ms pulse width, 1% duty cycle at 25°C |
Emitter Configuration | 4 emitters |
Die Size | 170±10μm × 170±10μm |
Die Thickness | 130±10μm |
Bond Pad Size | 87±3μm × 85±3μm |
Back Electrode Size | 170±10μm × 170±10μm |
This model is the 8mW-class four-emitter choice for customers who need the documented 8.0mW typical output at 15mA. Its square outline can simplify mechanical comparison with the 7mW model, but shared dimensions do not establish electrical, thermal or optical interchangeability.
For a 7mW-class operating point in the same four-emitter die-size class, review the 665nm 7mW VCSEL Bare Die. The two products should be compared using the complete output, voltage, current and package-level test requirements rather than power value alone.
3. Packaging, Optical Module and Application Development
OSAT and Custom Laser Packaging
The 665nm 8mW VCSEL Bare Die provides a defined mechanical and electrical starting point for higher-output four-emitter package trials. Relevant engineering work includes:
- Placement repeatability for the 170μm square die
- Attach-material selection and process-window testing
- Wire-bond tool access to the 87±3μm × 85±3μm pad
- Ceramic-submount routing and thermal-path design
- Custom TO-can, ceramic or application-specific laser packages
- Packaged-source screening and lot-to-lot qualification
The package designer must protect the bare die from mechanical damage and ESD while maintaining the required bond geometry and heat path. The 15mA value is a stated characterization condition; it must not be interpreted as an absolute maximum current or copied into a production driver without qualification.
Lens and Optical Module Integration
The 8mW-class output point gives optical-module teams a separate source option when allocating power through a package, window, lens, diffuser or beam-shaping assembly. The useful delivered output and power density will be determined by coupling losses, source placement, package aperture, working distance and the selected optics.
Module trials should therefore measure the packaged source rather than rely on bare-die output alone. Alignment tolerance, beam distribution, optical uniformity and temperature response should be evaluated at the intended pulse condition and mechanical stack-up.
Downstream Application Development
The source datasheet lists sensor light sources, consumer electronic products, machine vision and red lighting. The 665nm 8mW VCSEL Bare Die can enter those development paths only after it has been assembled into a suitable package and validated with the customer’s driver and optical system.
For PBM, beauty or hair-growth research, this die may be considered only as a component-level optical-source possibility for package and module evaluation. The wording does not claim therapeutic benefit, medical efficacy, clinical performance, finished-device safety, certification or regulatory approval.
4. Evaluation Kit and Documentation Support
An Evaluation Kit discussion for the 665nm 8mW VCSEL Bare Die can support package-process trials, electrical characterization and early optical-module experiments. The request should state the target package form, pulse condition, optical setup and the measurements the engineering team intends to perform.
- 10 pcs / KIT
- Product datasheet and die-dimension documentation
- Discussion of output, wavelength, emitter configuration and package requirements
- International shipping quoted according to destination
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
5. Frequently Asked Questions
FAQ 1. What output, emitter and die-size specifications define the 665nm 8mW VCSEL Bare Die?
The datasheet specifies 6.0mW minimum and 8.0mW typical optical output at 15mA under a 25°C QCW condition with 0.5ms pulse width and 1% duty cycle. The die has four emitters, measures 170±10μm × 170±10μm and is 130±10μm thick.
Its wavelength is specified as 660nm minimum, 665nm typical and 670nm maximum. These are component-level datasheet values; the packaged source and complete module require separate verification.
FAQ 2. How does the 665nm 8mW four-emitter die differ from the 7mW option under the stated QCW test conditions?
Both products use four emitters and the same stated 170±10μm square die size. The 8mW model is specified at 6.0mW minimum and 8.0mW typical output at 15mA, while the 7mW model is specified at 5.0mW minimum and 7.0mW typical output at 18mA.
Because the characterization currents differ, the comparison does not by itself prove drop-in compatibility or finished-module efficiency. The customer should compare voltage, driver behavior, heat flow, package loss and optical performance in the intended assembly.
FAQ 3. What packaging and thermal-path checks are required for integrating the 665nm 8mW VCSEL Bare Die?
The package plan should verify die orientation, placement tolerance, attach material, bond-pad access, wire geometry, ESD control, submount routing, thermal resistance and package cleanliness. It should also prevent mechanical or environmental exposure of the unpackaged chip.
After assembly, the engineering team should test wavelength, optical output, beam distribution, power density and temperature behavior with the actual driver and optics. The datasheet test point is a component characterization reference, not a substitute for finished-package qualification.