665nm
665nm 7mW VCSEL Bare Die
665nm 7mW multi-mode VCSEL bare die with four emitters, 170 × 170μm die size and QCW output at 18mA for wire bonding and custom red laser packaging.
Specifications
- Product Type
- Multi-mode VCSEL Bare Die
- Wavelength
- 665 nm typ.
- Optical Output Power
- 7mW class, 7.0mW typ. @ IF = 18mA
- Emitter Configuration
- 4 Emitters
- Operating Mode
- QCW, 0.5ms Pulse Width, 1% Duty Cycle
- Die Size
- 170±10 μm × 170±10 μm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 665nm 7mW VCSEL Bare Die for Packaging and Module Integration
The 665nm 7mW VCSEL Bare Die is a four-emitter, multi-mode visible-red VCSEL chip for die attach, wire bonding, ceramic-submount assembly and custom laser packaging. It is intended for component and module teams that need an exact 665nm, 7mW-class bare-die option rather than a finished laser package.
At 25°C under the datasheet QCW condition of 0.5ms pulse width and 1% duty cycle, the device provides 5.0mW minimum and 7.0mW typical optical output at 18mA. Its 170±10μm × 170±10μm square die contains four emitters and a 87±3μm × 85±3μm bond pad, giving packaging engineers concrete dimensions for placement, bonding and submount-layout evaluation.
This product is relevant to:
- OSAT teams qualifying 665nm VCSEL die-attach and wire-bonding processes
- Laser-component manufacturers developing ceramic or TO-can packages
- Optical-module engineers evaluating a four-emitter visible-red source
- Submount designers working with a 170μm-class square die
- Sourcing teams comparing adjacent output options within the 665nm Bare Die Series
Because this is an unpackaged semiconductor die, the customer must design and verify the mounting, electrical connection, thermal path, protective package and downstream optics. The stated optical values are datasheet test results, not finished-module performance guarantees.
2. Optical Configuration and Packaging Direction
The 665nm 7mW VCSEL Bare Die combines a four-emitter layout with a square die outline. The following values are the selection-critical conditions stated in the product datasheet.
Parameter | Datasheet Value |
|---|---|
Optical Output Power | 5.0mW min. / 7.0mW typ. @ IF = 18mA |
Wavelength | 661nm min. / 665nm typ. / 669nm max. |
Threshold Current | 4.0mA min. / 4.9mA typ. |
Forward Voltage | 2.4V min. / 2.6V typ. / 2.8V max. @ IF = 18mA |
Operating Condition | QCW, 0.5ms pulse width, 1% duty cycle at 25°C |
Emitter Configuration | 4 emitters |
Die Size | 170±10μm × 170±10μm |
Die Thickness | 130±10μm |
Bond Pad Size | 87±3μm × 85±3μm |
Back Electrode Size | 170±10μm × 170±10μm |
This model is the 7mW-class choice when a project requires four emitters, the documented 18mA QCW test point and the 170μm square die geometry. It should be evaluated as a distinct electrical and optical component; the datasheet test current is not an absolute maximum rating or a universal module drive recommendation.
For a higher-output four-emitter option with the same stated die size, review the 665nm 8mW VCSEL Bare Die. Its 8.0mW typical output is specified at a different current, so package, driver, thermal and optical performance must be verified independently rather than treated as a drop-in substitution.
3. Packaging, Optical Module and Application Development
OSAT and Custom Laser Packaging
The four-emitter layout and dimensional data support controlled process planning for bare-die integration. Packaging work can include:
- Die placement and attach-process development
- Gold-wire bonding and bond-loop evaluation
- Ceramic-submount layout and electrical routing
- TO-can or custom laser-package development
- Thermal-path and package-material verification
- Incoming inspection and second-source qualification
The 87±3μm × 85±3μm bond pad and square back electrode provide the starting geometry for tool access and submount design. Bonding parameters, adhesive or solder selection, ESD controls and thermal limits must be established by the packaging team because the datasheet does not define a complete assembly process or absolute maximum ratings.
Lens and Optical Module Integration
After packaging, the 665nm 7mW VCSEL die can be evaluated with application-specific optics. Module-development work may include collimation, diffusion, beam shaping, optical alignment and mechanical registration between the packaged source and lens system.
The raw die dimensions and four-emitter configuration help the optical team define source placement and package-to-lens tolerances. The final beam profile, working distance, power density and optical uniformity depend on the package, drive condition and downstream optics and must be measured in the customer’s assembled module.
Downstream Application Development
The datasheet identifies sensor light sources, consumer electronic products, machine vision and red lighting as application directions. For those uses, the 665nm 7mW VCSEL Bare Die remains a component that must first be packaged and qualified in the intended electrical, thermal and optical system.
PBM, beauty and hair-growth projects may evaluate this die only as a component-level visible-red optical-source possibility during package or module development. These application examples do not represent medical efficacy, clinical performance, therapeutic claims, regulatory approval or certification of a customer’s finished device.
4. Evaluation Kit and Documentation Support
The 665nm 7mW VCSEL Bare Die can be discussed for an Evaluation Kit intended for die-attach trials, wire-bonding verification and initial packaged-source testing. A useful evaluation request should identify the intended package, drive condition, optical arrangement and measurement objective.
- 10 pcs / KIT
- Product datasheet and die-dimension documentation
- Review of wavelength, output, emitter layout and package-integration requirements
- International shipping quoted according to destination
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
5. Frequently Asked Questions
FAQ 1. What output, emitter and die-size specifications define the 665nm 7mW VCSEL Bare Die?
The datasheet specifies 5.0mW minimum and 7.0mW typical optical output at 18mA under a 25°C QCW test condition with 0.5ms pulse width and 1% duty cycle. The device uses four emitters in a 170±10μm × 170±10μm die with 130±10μm thickness.
These values define the component supplied for evaluation. They do not define the output of a finished module, which also depends on die attach, electrical drive, package losses, thermal behavior and downstream optics.
FAQ 2. When should a packaging project select the 665nm 7mW four-emitter die instead of the 8mW option?
Select the 7mW model when the project specifically targets the documented 7.0mW typical output at 18mA and wants a four-emitter, 170μm square die for package-process validation. The adjacent 8mW model has the same stated emitter count and die size but is characterized at a different electrical operating point.
The selection should therefore be based on the required packaged-source output, driver design, thermal path, optical system and qualification plan. Neither device should be treated as interchangeable without module-level testing.
FAQ 3. What die-attach, wire-bonding and ceramic-submount steps should be evaluated for the 665nm 7mW VCSEL Bare Die?
Evaluation should cover die orientation and placement accuracy, attach material and cure or reflow process, bond-pad access, wire material and loop geometry, ESD handling, submount routing, heat flow and package cleanliness. The package should then be tested under the intended pulse condition with the selected optical assembly.
The customer should also verify packaged-device wavelength, optical output, uniformity, power density and temperature behavior. These are integration results and cannot be inferred solely from the bare-die datasheet.