660nm
660nm 5mW VCSEL Bare Die
660nm 5mW VCSEL Bare Die for die attach, wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.
Specifications
- Product Type
- Multi-mode VCSEL Bare Die
- Wavelength
- 660 nm typ.
- Optical Output Power
- 5mW class, 5mW typ. @ IF = 10mA
- Emitter Configuration
- 3 Emitters
- Operating Mode
- QCW, 0.5ms Pulse Width, 1% Duty Cycle
- Die Size
- 200±10 μm × 200±10 μm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 660nm 5mW VCSEL Bare Die for Packaging and Module Integration
The 660nm 5mW VCSEL Bare Die is a three-emitter, multi-mode visible-red VCSEL chip developed for chip-level packaging, die attach, wire bonding, ceramic-submount assembly and custom laser-module integration.
This medium-output red VCSEL die provides 5mW typ. optical output under a 10mA, 25°C QCW test condition. Its 200±10μm × 200±10μm square footprint and three-emitter configuration support projects requiring higher optical output than a single-emitter validation die while maintaining compact package dimensions and a relatively simple emitter layout.
This VCSEL laser chip is intended for:
- OSAT semiconductor assembly and test providers
- VCSEL and laser-diode packaging companies
- SMD, TO-can and ceramic package developers
- Die-attach and wire-bonding engineering teams
- Ceramic-submount and COB integrators
- Laser-module and optoelectronic-module manufacturers
- Lens, collimation and beam-shaping companies involved in laser-source integration
- Laser bare-die, component and optical-module distributors
- Technical sourcing and second-source development teams
The VCSEL die can be integrated into custom SMD packages, TO-can packages, ceramic packages and compact optical modules. As an unpackaged semiconductor chip, it requires suitable mounting, bonding, thermal-path, package and optical-integration processes before use in a finished device or module.
2. Optical Configuration and Packaging Direction
The 660nm 5mW VCSEL chip uses a three-emitter, multi-mode structure for medium-output optical-source packaging and packaging-process development.
Parameter | Value |
|---|---|
Optical Output Power | 5mW typ. @ IF = 10mA |
Center Wavelength | 660nm typ. |
Wavelength Range | 650nm min. / 660nm typ. / 670nm max. |
Threshold Current | 4.0mA typ. |
Forward Voltage | 2.6V typ. @ IF = 10mA |
Slope Efficiency | 0.45W/A min. / 0.65W/A typ. |
Power Conversion Efficiency | 16% typ. @ IF = 10mA |
Beam Divergence | 19° typ. @ IF = 10mA |
Operating Condition | QCW, 0.5ms pulse width, 1% duty cycle |
Die Size | 200±10μm × 200±10μm |
Die Thickness | 125±5μm |
Number of Emitters | 3 |
Bond Pad Size | 88±3μm × 88±3μm |
Back Electrode Size | 200±10μm × 200±10μm |
The device can be supplied as VCSEL die for packaging in:
- Die-attach process development
- Wire-bonding verification
- Ceramic-submount assemblies
- Chip-on-submount assembly
- Custom SMD laser packages
- TO-can and ceramic packages
- Compact visible-red optical modules
- Lens and beam-shaping optical assemblies
Compared with the 660nm 2mW single-emitter model, the 5mW device is positioned as the three-emitter, medium-output option for projects requiring higher optical output while maintaining compact bare-die integration. Compared with the 660nm 7mW six-emitter model, the 5mW device provides a simpler emitter layout for packaging-process evaluation and medium-output module development.
3. Packaging, Optical Module and Application Development
OSAT and Custom Laser Packaging
The 660nm 5mW bare die supports wire-bonding VCSEL projects, ceramic-submount assembly and application-specific laser-device development.
Packaging directions include:
- VCSEL die attach
- Wire-bonding process verification
- Custom SMD laser packages
- TO-can laser packages
- Ceramic laser packages
- Ceramic-submount optical sources
- Chip-on-submount assembly
- Compact COB and optical modules
- Three-emitter visible-red devices
The three-emitter structure allows packaging teams to develop a compact red VCSEL source with higher output than a single-emitter die while avoiding the layout complexity of a higher emitter-count die.
Lens and Optical Module Integration
The device can support lens, collimation and beam-shaping companies developing integrated laser-source assemblies.
Possible integration directions include:
- Collimation-lens assemblies
- Beam-shaping optical components
- Diffuser-integrated modules
- Lens-integrated VCSEL sources
- Compact visible-red optical modules
- Three-emitter red VCSEL source modules
Downstream Application Development
The datasheet identifies sensor light sources, consumer electronic products, machine vision and red lighting as application directions.
The device can also support:
- Compact visible-red laser modules
- Alignment and indication sources
- Optical sensor light sources
- Engineering and research light sources
- Machine-vision support illumination
- Beauty and personal-care prototypes
- Photobiomodulation-related optical development
- Hair-growth and scalp-light device development
These are downstream directions after the VCSEL bare die has been integrated into an appropriate package or optical module. The primary focus of this page remains bare-die supply, wire bonding, custom packaging and module integration.
The product is also available to laser-component agents, module distributors and second-source development teams supporting customer packaging and integration projects.
SMD Package Option for PCB-Level Integration
For customers who need a completed surface-mount package instead of chip-level integration, 1ONELASER also supports 660nm 5mW VCSEL SMD package options for SMT placement, reflow soldering and PCB-level integration.
The 660nm 5mW SMD options include 2016, 2835 and 5730 packages for customers developing compact visible-red light-source products, PCB-mounted red VCSEL modules and application-specific optical devices.
4. Evaluation Kit and Documentation Support
The 660nm 5mW VCSEL Bare Die is available as an Evaluation Kit for packaging trials, die-attach development, wire-bonding verification and initial optical integration.
- 10 pcs / KIT
- Product datasheet and die-dimension documentation
- International shipping quoted according to destination
- Center wavelength, wavelength tolerance, optical output power, power-bin selection and emitter-configuration requirements can be discussed
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
5. Frequently Asked Questions
FAQ 1. What packaging methods are suitable for the 660nm 5mW VCSEL Bare Die?
The device can be used for die attach, wire bonding, ceramic-submount assembly, chip-on-submount assembly, custom SMD packages, TO-can packages, ceramic packages and compact optical-module integration.
As an unpackaged die, it must be integrated using an appropriate mounting, bonding, thermal-path and package design.
FAQ 2. What is the emitter configuration of the 660nm 5mW VCSEL Bare Die?
The device uses a three-emitter structure and has a 200±10μm × 200±10μm die footprint.
It provides 5mW typ. optical output under a 10mA, 25°C QCW test condition, with a typical beam divergence of approximately 19°. The QCW condition uses a 0.5ms pulse width and 1% duty cycle.
FAQ 3. Can the wavelength, optical output, power bin or package configuration be customized?
Center wavelength, wavelength tolerance, optical output, power-bin selection and package-integration requirements can be discussed according to the project.
Projects requiring different output levels or emitter configurations can select from the 660nm 2mW, 5mW and 7mW VCSEL Bare Die models or submit a custom-development request.
660nm 5mW Datasheet Download ↓