660nm
660nm / 850nm / 940nm / 1064nm Four-Wavelength VCSEL SMD 3227
660nm / 850nm / 940nm / 1064nm four-wavelength VCSEL SMD in a 3227 package for custom optical-source, PCB, driver and thermal-integration evaluation.
Specifications
- Product Type
- Four-Wavelength VCSEL SMD
- Wavelength Channels
- 660nm, 850nm, 940nm and 1064nm
- Optical Output Power
- 660nm: 5–7mW at 15mA; 850nm: 5–7mW at 8mA; 940nm: 5–7mW at 8mA; 1064nm: 15–20mW at 25mA
- Emitter Configuration
- Four VCSEL channels in a multi-chip 3227 SMD package with integrated Zener protection
- Operating Mode
- CW test conditions
- Optical Emission Profile
- 19–22° beam divergence
- SMD Package Options
- 3227 SMD package
660nm / 850nm / 940nm / 1064nm Four-Wavelength VCSEL SMD for Compact Multi-Channel Optical-Source Integration
The 660nm / 850nm / 940nm / 1064nm Four-Wavelength VCSEL SMD 3227 combines four source-specified VCSEL channels in a compact multi-chip surface-mount package. It is intended for OEM and engineering teams evaluating a compact multi-channel optical source with a defined PCB, driver, optical-coupling, and thermal-integration path.
The released source specifies CW test conditions, a 19–22° beam divergence, and an integrated Zener structure within the 3227 package. The optical output values are channel-specific ranges measured at different currents and must not be added together as an unsupported total optical-output value. Integrated Zener protection is a package-level source description, not an automatic ESD rating for the finished system.
Multi-Wavelength Optical Configuration and Channel Selection
The four channels provide a compact wavelength set for a custom optical-source architecture. The source specifies 660nm output of 5–7mW at 15mA, 850nm output of 5–7mW at 8mA, 940nm output of 5–7mW at 8mA, and 1064nm output of 15–20mW at 25mA.
These values are source ranges rather than typical values. Channel selection should consider the customer's required wavelength, current, optical coupling, beam distribution, measurement method, thermal path, and enclosure geometry. Keep every optical measurement tied to its channel and test current; do not convert the ranges into a total power or a single nominal output.
3227 Package, Electrical Interface and PCB Integration
The 3227 SMD format is intended for compact PCB placement of a multi-chip, four-channel optical source. The source identifies integrated Zener protection and a 19–22° beam divergence. Review the released electrical drawing for channel marking, pin assignment, package orientation, pad layout, forward-voltage checks, soldering conditions, storage, and electrostatic handling.
During evaluation, confirm the driver's channel control, current limits, PCB clearance, reflow process, optical-axis alignment, thermal path, lens or diffuser interface, and assembly repeatability. Do not infer a universal ESD rating from the integrated Zener description, and do not treat the 3227 package as directly interchangeable with the 5050 PCT or 5050T ceramic versions without project-specific verification.
Multi-Channel Optical-System Development and Custom Integration
This four-wavelength 3227 SMD is suited to compact component-level optical-source development where the customer needs multiple wavelength channels in a multi-chip package. Engineering work may include driver architecture, channel sequencing, optical coupling, beam distribution, thermal design, enclosure geometry, and measurement repeatability.
The released 660nm / 850nm / 940nm / 1064nm 3227 configuration is the standard specification described by this page. If a project needs another wavelength combination, output condition, package material, electrical interface, channel layout, or integrated optical element, those requirements must be reviewed as a project-specific custom configuration. The component does not establish medical efficacy, clinical performance, finished-device safety, certification, or competitor equivalence.
Evaluation, Documentation and Custom Development Support
For component-level evaluation, review the released datasheet together with the customer's driver, PCB, optical coupling, thermal, and assembly requirements. An Evaluation Kit with 10 pcs / KIT is available for checking four-channel addressing, per-channel output, integrated-Zener package behavior, compact PCB fit, optical alignment, and early assembly repeatability.
Before production integration, confirm the applicable electrical limits, CW test conditions, soldering profile, ESD handling, optical measurement method, and customer-system exposure conditions against the current technical documentation. Documentation applies to this component configuration and does not certify the customer's finished device.
Frequently Asked Questions
What are the source-specified output conditions for the four channels?
The source reports 660nm at 5–7mW at 15mA, 850nm at 5–7mW at 8mA, 940nm at 5–7mW at 8mA, and 1064nm at 15–20mW at 25mA. These are channel-level ranges and should not be added together as a total optical-output specification.
Does the integrated Zener establish a finished-system ESD rating?
No. The source describes integrated Zener protection at package level. A finished-system ESD result depends on the complete driver, PCB, assembly, handling process, and applicable test method, so it must be evaluated separately.
When should an OEM compare the 3227 version with the 5050 package options?
The 3227 page owns its compact package and source-specific output conditions. The 5050 PCT and 5050T ceramic pages describe different package configurations. Choose between them using verified electrical, mechanical, thermal, optical, and assembly requirements rather than assuming direct interchangeability.
