Product Overview
1. Standard VCSEL Bare Die for 1064nm Compact NIR Sensing
This 1064nm 30mW VCSEL bare die is designed for compact near-infrared sensing, active optical detection, machine vision support, industrial sensing, and small optical source module development.
The product is supplied as a standard VCSEL bare die by default. It is suitable for 1064nm compact sensing modules, NIR optical source evaluation, optical detection systems, machine vision auxiliary source designs, and chip-level VCSEL integration projects.
With 30mW typical optical output power at IF = 35mA, this device provides a compact 1064nm VCSEL source for applications requiring slightly higher optical output than low-power 20mW-class devices while maintaining a small die-level format.
2. Key Features
This 1064nm 30mW VCSEL bare die is supplied as a standard compact VCSEL device for NIR sensing and optical source applications.
Key features include 1064nm typical wavelength, 30mW typical optical output power, 6-emitter VCSEL layout, 2.0V typical forward voltage, 41% typical power conversion efficiency, 21° typical beam divergence at 1/e², and doughnut-shaped symmetrical far-field output.
The compact 163μm × 185μm die size and 6-emitter structure allow flexible integration into ceramic submounts, chip-on-board assemblies, compact optical modules, and customer-specific VCSEL packages.
Package-level assembly, wire bonding, ceramic submount mounting, drive condition review, beam shaping, divergence control, and customer-specific optical spot requirements can also be reviewed according to the customer's optical, electrical, thermal, and mechanical layout.
3. Application Development Direction
This device supports 1064nm compact NIR sensing, active optical detection, machine vision support, industrial sensing, compact illumination, and custom VCSEL source integration.
In a compact sensing or active optical detection module design, the VCSEL wavelength, output power, drive current, forward voltage, package structure, beam profile, detector response, optical path, and final system signal behavior should be reviewed together.
The 30mW-class output power provides a useful compact VCSEL option for 1064nm optical source designs, especially where small die size, moderate pulse optical output, simple chip-level assembly, or customized VCSEL package development is required.
4. Evaluation Sample Kit and Documentation Support
Paid evaluation sample kits can be arranged for selected standard VCSEL chip products, subject to product availability and project review. International express shipping can also be arranged depending on the destination.
An Initial Product Report has been filed with the U.S. FDA CDRH for the Laser Diode Series, including the VCSEL Laser Diode Chip Series. CE-related documentation is also available for project evaluation, including EMC documentation and EN 60825 laser safety / LVD test documentation. Material compliance documentation, including RoHS, REACH, and HF documentation, can also be provided upon request.
For 1064nm compact sensing, active optical detection, machine vision support, industrial sensing, and small optical source projects, bare die mounting, ceramic submount assembly, chip-on-board integration, wire bonding, beam shaping, drive condition review, or customized package discussion is available according to the project requirements.
Please contact us for sample testing, engineering evaluation, or custom project support.
1064nm 30mW VCSEL Bare Die Datasheet Download ↓
