1064nm
1064nm VCSEL Bare Die Series
1064nm VCSEL bare die series with 20mW, 30mW and 3W options for NIR sensing, machine vision, industrial detection, custom packaging and optical modules.
Specifications
- Product Type
- Multi-mode VCSEL Bare Die
- Wavelength
- 1064 nm typ.
- Optical Output Power
- 20mW / 30mW / 3W
- Emitter Configuration
- 4 / 6 / 624 emitters
- Operating Mode
- QCW / Pulse / CW options
- Die Size
- 170±10μm × 170±10μm / 163±10μm × 185±10μm / 1075±10μm × 1120±10μm
- Recommended Assembly
- Wire bonding / ceramic submount / custom packaging
1. 1064nm VCSEL Bare Die Supply for Packaging and Module Integration
The 1064nm 20mW–3W VCSEL Bare Die Series includes compact low-power multi-emitter chips and a high-power VCSEL array for semiconductor packaging, near-infrared source development and custom optical-module integration.
The available optical-output classes include 20mW, 30mW and 3W. The 20mW and 30mW devices are characterized under QCW pulse conditions, while the 3W model is suitable for CW or QCW application development. The published 2.9W minimum and 3.1W typical output values for the 3W device are specified under a 25°C QCW test condition.
The series provides a typical center wavelength of 1064nm and includes 4-emitter, 6-emitter and 624-emitter configurations. Typical beam divergence is approximately 20°–21° at 1/e², depending on the selected model.
These 1064nm multi-mode VCSEL devices are supplied as unpackaged semiconductor bare dies for conductive die attachment, gold-wire bonding, ceramic-submount assembly, chip-on-board integration, custom VCSEL packaging and application-specific NIR optical-source development.
The different optical-output levels, emitter counts, die dimensions, drive-current requirements and operating conditions allow customers to select a suitable model according to package space, target output, electrical design, thermal path, working distance, detector response and optical-system architecture.
This series is intended for:
- OSAT semiconductor assembly and test providers
- VCSEL and laser-diode packaging companies
- Ceramic-submount and COB integrators
- Die-attach and gold wire-bonding engineering teams
- Custom SMD, TO-can and ceramic-package developers
- NIR sensing and active optical-detection companies
- Machine-vision and camera auxiliary-source developers
- Industrial sensing and optical-inspection teams
- Lens, diffuser, collimation and beam-shaping companies
- Optical-module and application-specific source developers
- Engineering laboratories and research institutions
- Technical sourcing and second-source development teams
As a 1064nm VCSEL bare die supplier, 1ONELASER supports model selection, evaluation samples, power-bin discussion, ceramic-submount integration, custom packaging and optical-module development.
The devices can be integrated into custom SMD packages, TO-can packages, ceramic laser packages, ceramic-submount assemblies, COB optical sources and customer-specific near-infrared modules. As unpackaged semiconductor chips, these products require appropriate die mounting, wire bonding, package protection, electrical design, thermal-path design and optical integration before use in a finished device.
2. 20mW, 30mW and 3W VCSEL Bare Die Model Selection
The 1064nm VCSEL Bare Die Series provides two compact QCW pulse devices and one high-power VCSEL array for different packaging and optical-source requirements.
Model selection should consider optical output, test current, forward voltage, operating condition, emitter count, die dimensions, beam divergence, package structure, thermal path and final optical-system requirements.
Product | Optical Output | Operating Mode | Test Condition | Emitters | Die Size | Divergence |
|---|---|---|---|---|---|---|
9mW min. 20mW typ. | QCW / Pulse | 25mA, 25°C 0.5ms, 1% | 4 | 170 ±10μm × 170 ±10μm | 21° typ. 1/e² | |
25mW min. 30mW typ. | QCW / Pulse | 35mA, 25°C 0.5ms, 1% | 6 | 163 ±10μm × 185 ±10μm | 21° typ. 1/e² | |
2.9W min. 3.1W typ. | CW / QCW capable | 3.5A, 25°C QCW model | 624 | 1075 ±10μm × 1120 ±10μm | 20° typ. 1/e² |
The optical-output values and test conditions are model-specific. The 20mW and 30mW products are specified under 0.5ms pulse width and 1% duty-cycle conditions.
The 3W device is suitable for CW or QCW application development, but its published 2.9W minimum and 3.1W typical optical-output values are measured at 3.5A and 25°C under a QCW model. Continuous-wave operation requires separate package-level thermal design and validation.
1064nm 20mW VCSEL Bare Die
The 1064nm 20mW VCSEL Bare Die provides 9mW minimum and 20mW typical optical output at a 25mA QCW pulse condition.
It uses four emitters in a compact 170 ±10μm × 170 ±10μm die. The device can support low-power NIR sensing, short-distance optical detection, compact active illumination, initial packaging evaluation and small application-specific optical modules.
1064nm 30mW VCSEL Bare Die
The 1064nm 30mW VCSEL Bare Die provides 25mW minimum and 30mW typical optical output at a 35mA QCW pulse condition.
It uses six emitters in a compact 163 ±10μm × 185 ±10μm die. The model can support active optical detection, machine-vision auxiliary-source development, industrial sensing, compact NIR illumination and custom packaged VCSEL sources requiring more output than the 20mW option.
1064nm 3W VCSEL Bare Die
The 1064nm 3W VCSEL Bare Die provides 2.9W minimum and 3.1W typical optical output at 3.5A and 25°C under the published QCW test condition.
It uses a 624-emitter array in a 1075 ±10μm × 1120 ±10μm die. The product is suitable for high-power NIR illumination, machine-vision auxiliary sources, industrial optical detection, active sensing and custom high-power VCSEL module development.
The device can be evaluated for CW or QCW applications. For continuous-wave integration, the ceramic submount, die-attach material, bond-wire structure, current distribution, heatsink and package-level thermal path must be validated under the customer's actual operating conditions.
3. Packaging, Optical Module and Application Development
OSAT and Custom VCSEL Packaging
The 1064nm VCSEL bare dies can be supplied for conductive die attachment, gold-wire bonding, ceramic-submount assembly, custom SMD packages, TO-can packages, ceramic laser packages and chip-on-board optical-source integration.
Packaging and integration directions include:
- VCSEL die attachment
- Gold-wire bonding
- Ceramic-submount assembly
- Custom VCSEL packaging
- Custom SMD laser packages
- TO-can laser packages
- Ceramic laser packages
- COB optical-source assemblies
- Multi-emitter VCSEL array modules
- Application-specific 1064nm NIR source packages
The package should be designed according to the selected device's die dimensions, electrode structure, drive current, forward voltage, emitter count, output level, operating mode and thermal requirements.
The dies are ESD-sensitive semiconductor components. Appropriate electrostatic-control procedures are required throughout storage, handling, die placement, wire bonding, package assembly and testing.
Low-Power Bare Die Packaging
The 20mW and 30mW models use compact die dimensions and relatively low pulse currents. They can support small ceramic packages, compact COB sources, custom SMD development and space-constrained optical modules.
Although these models have lower optical output than the 3W array, die orientation, bond-pad access, pulse-driver conditions, package protection and optical alignment still require package-level validation.
High-Power Ceramic Packaging and Thermal Design
The 3W model requires a package structure capable of supporting a 624-emitter array, 3.5A drive current, current distribution, effective die attachment and a controlled thermal path.
High-power integration should consider:
- Ceramic-submount material
- Die-attach thermal performance
- Bond-wire number and current capacity
- Electrical-path symmetry
- Package and PCB parasitics
- Heatsink structure
- Junction and submount temperature
- CW or QCW operating condition
- Mechanical stress and package protection
- External lens or diffuser alignment
Continuous-wave operation should not be confirmed from nominal optical-output power alone. Package-level thermal performance and output stability must be validated under the intended current, temperature and cooling conditions.
Lens, Diffuser and Beam-Shaping Integration
The bare-die format allows optical-module developers to select the ceramic submount, optical window, lens, diffuser, collimator and mechanical interface according to the final source design.
Possible integration directions include:
- Collimation-lens assemblies
- Beam-shaping optical components
- Diffuser-integrated VCSEL modules
- Lens-integrated NIR sources
- FOV-controlled illumination modules
- Machine-vision auxiliary sources
- Application-specific optical assemblies
The products provide doughnut-shaped, symmetrical far-field output. Final optical performance depends on the selected chip, emitter configuration, beam divergence, package-window geometry, lens or diffuser design, working distance and mechanical alignment.
NIR Sensing, Machine Vision and Active Optical Detection
The 1064nm VCSEL Bare Die Series can support development and evaluation in the following directions:
- Near-infrared sensing
- Active optical detection
- Machine-vision auxiliary illumination
- Camera-related NIR source development
- Industrial optical detection
- Industrial inspection systems
- Short-distance optical sensing
- High-power NIR illumination
- Engineering and research light sources
- Custom optoelectronic modules
Product selection should consider optical-output requirements, drive current, pulse or CW operation, detector response, working distance, required optical field, package space, thermal design and the final signal-processing architecture.
The VCSEL bare die is one component of the completed optical system. Final detection performance, illumination distribution and source reliability depend on the driver, package, thermal path, optics, detector, mechanical alignment and operating environment.
For application-level source selection and optical-system planning, visit the Sensing & Machine Vision solution page.
For high-power packaging, thermal and optical-module development, visit the High-Power NIR & Optical Modules solution page.
Distribution and Supply-Chain Support
The 1064nm VCSEL Bare Die Series is available to laser-component distributors, optical-module suppliers, technical sourcing companies and second-source development teams supporting customer packaging and integration projects.
Documentation, evaluation samples, model selection, power-bin requirements, packaging requirements and volume-supply planning can be discussed according to the project stage.
4. Evaluation Kit and Documentation Support
The 1064nm VCSEL Bare Die Series is available as an Evaluation Kit for die-attach trials, wire-bonding development, package evaluation, driver testing, thermal validation and initial optical integration.
The Evaluation Kit includes:
- 10 pcs / KIT
- One selected 20mW, 30mW or 3W model per kit
- Corresponding product datasheet
- Die-dimension and assembly documentation
- International shipping quoted according to destination
Evaluation can support:
- Conductive die-attach trials
- Gold-wire bonding development
- Ceramic-submount evaluation
- QCW pulse-driver testing
- CW thermal-path evaluation for the 3W model
- Package electrical and thermal review
- Optical alignment
- Lens and diffuser selection
- Beam-profile evaluation
- Initial sensing and illumination testing
The following requirements can be discussed according to the project:
- Center wavelength
- Wavelength tolerance
- Optical output power
- Power-bin selection
- QCW, Pulse or CW operating requirements
- Emitter configuration
- Die size and bond-pad layout
- Ceramic-submount requirements
- Custom SMD, TO-can or ceramic packaging
- Lens, diffuser and beam-shaping integration
- Optical-module development
- Volume-supply requirements
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer's finished device.
5. Frequently Asked Questions
FAQ 1. What models are included in the 1064nm VCSEL Bare Die Series?
The series includes 20mW, 30mW and 3W optical-output classes. The 20mW model uses four emitters in a 170 ±10μm × 170 ±10μm die, while the 30mW model uses six emitters in a 163 ±10μm × 185 ±10μm die. Both are specified for QCW pulse operation. The 3W model uses a 624-emitter array in a 1075 ±10μm × 1120 ±10μm die and supports higher-power CW or QCW application development.
FAQ 2. Can the 1064nm 3W VCSEL bare die operate in continuous-wave mode?
The 3W device is described as suitable for CW or QCW applications. However, its published 2.9W minimum and 3.1W typical optical-output values are specified at 3.5A and 25°C under a QCW model. Continuous-wave use therefore requires separate validation of the die attach, ceramic submount, bond-wire structure, current distribution, heatsink and package temperature. The customer should not assume that the published QCW output is automatically maintained under continuous-wave operation.
FAQ 3. How should I select and package a 1064nm VCSEL bare die?
Select the model according to target optical output, operating mode, drive current, package space, emitter count, working distance, detector response and required optical field. The 20mW and 30mW chips suit compact pulse-source development, while the 3W array supports higher-output modules with more demanding thermal requirements. All three products require die attachment, wire bonding, ESD control and package protection. External lenses, diffusers or collimators can be added according to the completed optical-source architecture.