808nm VCSEL Laser Chips | Medical Diagnostics & Industrial Sensing
Available Format: Engineering Evaluation Kit (10 pcs / pack)
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Kit Configuration: 10× Laser Devices secured in Industrial ESD-Safe Shielding Packaging.
Understanding 808nm Laser Chips for Medical and Industrial Applications
🧠 About This Product
808nm VCSEL (Vertical-Cavity Surface-Emitting Laser) emitter chips provide efficient near-infrared emission with model-dependent wavelength range, beam divergence, and electro-optical characteristics. This 808nm portfolio covers 11 power options from 5mW to 3W, supporting integration from compact sensing illumination to higher-power optical/thermal subsystems. Bare-die options are available, and we support SMD/COB packaging and project-based customization from R&D to mass production.
808nm is widely used across Nd-doped solid-state laser pumping (e.g., Nd:YAG / Nd:YVO₄), NIR sensing illumination, and certain thermal processing/industrial applications. These VCSEL chips provide a more symmetric circular beam profile (system-dependent) compared with typical edge-emitters and a more concentrated divergence than LEDs (model-dependent). For pumping architectures, narrow spectral width (model-dependent) and low wavelength temperature coefficient dλ/dT (typ. ~0.059–0.073 nm/°C, where specified) support system-level wavelength budgeting.
Key differentiators:
- Wide power range: 5mW → 3W (11 models)
- High PCE: up to ~46% (typ.) in low-power models; ~35–42% (typ.) in mid/high-power models
- Compact die sizes: ~140µm to ~1120µm (model-dependent)
- Symmetric circular beam: More symmetric beam profile simplifies optical design vs edge-emitters
- QCW and CW options: D-V0808M-2000-0042 is CW-specific
- Wavelength range: model-dependent (see datasheet)
Project-dependent screening/traceability & compliance documentation available upon request.
💡 Application Scenarios
System performance depends on optical design, drive conditions, thermal design, and regulatory/safety requirements.
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Solid-State Laser Pumping
Optical pumping for Nd:YAG / Nd:YVO₄. Coupling efficiency depends on crystal type/doping, temperature, wavelength binning, and optical alignment. -
Industrial Sensing / NIR Illumination
Material inspection, reflective sensing, spectroscopy. Outdoor environments require optical filtering and/or modulation/demodulation. -
Industrial Thermal / Selective Heating
Plastic welding, soldering, localized heating where optical power density and thermal management are engineered at system level. -
Medical/Professional PBM System Integration
808nm commonly used in PBM development. Efficacy/safety depends on complete device design (device-level validation required). -
Optical Sensing & Spectroscopy
NIR illumination for spectroscopy, moisture detection, and material analysis where 808nm emitters are used as a light source (system dependent).
🎯 Need Custom Specifications?
We offer customization for wavelength tolerance targets (e.g., ±2nm), beam divergence targets, chip dimensions, and power scaling. Our engineering team can design bespoke emitter layouts for regulated/professional modules and laser pumping system integration.
🔧 Request Custom & ODM Services💡 Questions? Email sales@1onelaser.com or visit Datasheets Center & Order Evaluation Kit
Technical Specifications
Note: Parameters characterized under test conditions in each datasheet (pulse width/duty cycle/heatsink temp differ by model). D-V0808M-2000-0042 characterized under CW. Values: Min/Typ/Max.
📊 Electro-Optical Parameters
| Power | Mode | Wavelength (nm) | Output Power | Threshold (mA) | Voltage (V) | PCE (%) | Div (°) | Die Size (µm) | Emitters |
|---|---|---|---|---|---|---|---|---|---|
| 5mW | QCW 0.5ms/1% | 800/808/816 | 5.5/6.0mW @ 7mA | 0.9/1.2/2.0 | 1.8/2.0/2.2 | 43/46 | 18/21/24 | 140×170 | 1 |
| 20mW | QCW 0.5ms/10% | 800/808/816 | 20/25mW @ 28mA | 3.5/4.5/6.0 | 2.0/2.3 | 38/40 | 18/21/24 | 170×170 | 4 |
| 30mW | QCW 0.5ms/10% | 800/808/816 | 30/38mW @ 42mA | 5.6/6.8/8.0 | 2.1/2.3 | 38/40 | 18/21/24 | 163×185 | 6 |
| 70mW | QCW 0.1ms/10% | 800/808/816 | 70/77/80mW @ 84mA | 11/15/19 | 2.1/2.2/2.3 | 39/40/41 | 22/25/28 | 455±10×200±10 | 12 |
| 100mW | QCW 0.1ms/10% | 800/808/816 | 110/120/130mW @ 140mA | 25/30/35 | 2.2/2.3/2.4 | 40/41/42 | 22/25/28 | 785±10×200±10 | 22 |
| 200mW | QCW 0.1ms/10% | 800/808/816 | 230/240/260mW @ 280mA | 45/60/65 | 2.2 (typ) | 37/38/40 | 26/28/30 | 895±10×200±10 | 22 |
| 400mW | QCW 0.1ms/10% | 800/808/816 | 420/440/460mW @ 520mA | 80/95/110 | 2.4/2.5/2.6 | 34/35/37 | 30/33/35 | 1005±10×230±10 | 48 |
| 1.5W | QCW 0.1ms/3% | 800/808/820 | 1.7/1.85W @ 2.0A | 200/350/400 | 2.0/2.2/2.4 | 40/42 | 22/24/26 | 855×810 | 280 |
| 2W QCW | QCW 0.1ms/10% | 798/808/818 | 2.0/2.3W @ 2.8A | 500/600/700 | 2.0/2.2/2.4 | 37/39 | 23/25/27 | 995×1020 | 410 |
| 2W CW | CW | 800/808/820 | 1.9/2.1W @ 2.2A (20°C) 1.7/1.9W (50°C) |
—/400/550 (Typ/Max,20°C) | 2.0/2.3/2.6 (20°C) 2.0/2.2/2.5 (50°C) |
37/41 (50°C) | 17/22/24 | 1080±10×1050±10 | ~410 |
| 3W | QCW 0.5ms/1% | 798/808/818 | 3.2/3.6W @ 4.0A | 690 (typ) | 2.1/2.2/2.4 | 41 (typ) | 17/21/23 | 1075×1120 | 624 |
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Common Specs: Emitter Aperture 5±0.5µm • Emitter Pitch 13±1µm • Die Thickness 100±15µm • dλ/dT ~0.059–0.073 nm/°C (critical for pumping) • Operating Temp -25 to +85°C • Storage -40 to +105°C • RoHS/REACH/HF compliant
Thermal Design: For 1.5W–3W models, efficient heat-sinking (TEC where needed) recommended for temperature margins, wavelength stability, and lifetime.
🌟 Product Advantages
-
808nm platform for PBM & pumping
Commonly used wavelength for PBM system development and solid-state laser pumping. -
Wide power range coverage
11 power options from 5mW to 3W cover applications from compact sensing to high-power systems. -
High power conversion efficiency
Up to ~46% (typ) in low-power models supports efficient driver and thermal budgeting. -
Symmetric circular beam
More symmetric beam profile (system-dependent) may simplify optical design compared to edge-emitters.
Product Comparison
🔬 808nm VCSEL vs. LED/EEL
Note: Indicative typical values only. Performance varies by supplier, package, optics, and test conditions. For reference only and not a specification commitment.
| Feature | VCSEL (808nm) | EEL (808nm) | LED (808nm) |
|---|---|---|---|
| Beam Profile | Symmetric circular | Elliptical | Wide Lambertian |
| Beam Divergence | ~17–35° (model-dependent) | ~10°×40° | ~120° |
| Spectral Width | Narrow (model-dependent) | 3–5nm FWHM | 30–50nm FWHM |
| PCE | ~35–46% (model-dependent) | 35–40% | 15–25% |
Frequently Asked Questions
❓ FAQ
Q1: What's the difference between QCW and CW operation modes?
A: QCW uses pulsed operation (model-specified pulse width/duty cycle) to manage thermal load. CW is continuous output requiring stricter thermal design. D-V0808M-2000-0042 is CW-specific and characterized for CW conditions.
Q2: Can these chips be used in medical devices?
A: Yes. These chips can be integrated into medical devices. System performance, safety, and regulatory compliance depend on complete device design. Project-dependent documentation can be provided upon request.
Q3: Why is 808nm commonly used for solid-state laser pumping?
A: 808nm is commonly used in pump architectures for Nd-doped crystals. Actual pumping efficiency depends on crystal type/doping, temperature, wavelength binning, and optical alignment/coupling.
Q4: How can I obtain samples?
A: Standard model laser diodes can be requested online through our Datasheets Center & Order Evaluation Kit page to submit your request. Evaluation Kits are available for qualified projects and applications. Pricing and availability will be confirmed based on your specific requirements.
💡 Ready to Integrate 808nm VCSEL?
Explore how our 808nm VCSEL chips can support laser pumping, industrial sensing, or thermal processing. Download datasheets from Datasheets Center & Order Evaluation Kit.
🔧 Request Custom & ODM ServicesQuestions? Email sales@1onelaser.com
📋 Detailed Application Scenarios
Primary Applications
-
PBM System Integration (Professional Equipment/Platform)
Integration into professional PBM platforms where irradiance delivery, thermal management, and safety controls are validated at device level. System performance depends on device design, dosage/irradiance, safety controls, and regulatory pathway (where applicable). -
Solid-State Laser Pumping (Optical Pumping near ~808nm)
Optical pumping for Nd:YAG, Nd:YVO₄, and other solid-state laser media commonly pumped near ~808nm. Suitable for pumping module development and system integration where coupling efficiency, thermal lensing, and wavelength drift are managed through system optics and temperature control. -
Industrial Thermal Processing / Selective Heating
Plastic welding, soldering, surface treatment, and selective heating processes where controlled optical power density and thermal design are required. VCSEL arrays suitable for compact thermal source modules where final temperature rise and heating rate depend on optical focusing, distance, material absorption, and heat dissipation design. -
NIR Spectroscopy / Sensing Illumination
808nm narrow-spectrum near-infrared illumination source for material identification, moisture/composition detection, and reflective/transmissive measurement systems. System design requires matching detectors, optical filters, and management of temperature drift and power stability.
Secondary Applications
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Modular Light Engine Platform
Standardized 808nm light source engine suitable for multi-model platform sharing. Different models achieve different spot sizes and output characteristics by changing optical components while using the same core light source module. -
R&D / Prototyping
Validation of optical coupling, driver design, thermal management, temperature drift budgeting, and beam shaping (diffusers/homogenizers/light guides/integrating rods). Suitable for rapid engineering prototyping and platform iteration. -
Scalable Arrays / Power Extension Platform
Array tiling to achieve higher total power or larger illumination area. Suitable for power-scalable system architectures with higher requirements for heat dissipation, uniformity, and driver consistency. -
Custom Wavelength/Binning/Divergence/Layout
Customization for specific coupling structures (fiber coupling, light guides, pump cavities) or specific system windows (temperature/size/packaging). Custom parameter and array layout design available on project basis.
What are 808nm Laser Chips?
808nm laser chips, particularly VCSEL (Vertical-Cavity Surface-Emitting Laser) types, are widely used in various applications. These laser chips emit light at a wavelength of 808 nanometers, making them ideal for medical diagnostics and industrial sensing. They provide high efficiency and excellent thermal performance, which is crucial for applications such as laser therapy and optical sensors. However, what sets these chips apart is their compact design, which allows for easy integration into various systems.
Applications in Medical Diagnostics
In the medical field, 808nm laser chips play a significant role in diagnostic equipment. They are particularly used in procedures such as photothermal therapy and laser imaging. Because of their precise wavelength, these chips help target specific tissues without damaging surrounding areas. Furthermore, the reliability of 808nm laser chips ensures accurate results, which is essential for patient safety and treatment efficiency. Therefore, their application in healthcare continues to expand, maximizing benefits for both patients and practitioners.
Industrial Sensing Capabilities
Beyond healthcare, 808nm laser chips are also pivotal in various industrial sensing applications. They are utilized in manufacturing processes for measuring distances and detecting objects. Their high sensitivity makes them suitable for environments where precision is crucial. Additionally, the laser chips offer robust performance in harsh conditions, enhancing operational reliability. As industries continue to innovate, the demand for efficient sensing solutions, like those provided by 808nm laser chips, is likely to grow significantly.
⚠️ Legal Notice
The products displayed on this website are semiconductor laser components and light source modules designed for integration into end devices. These components are not finished medical devices and require appropriate certification and regulatory approval by device manufacturers or brand owners. Compliance with IEC 60825-1, FDA regulations, and local photobiological safety standards for end products is the responsibility of the manufacturer or brand owner. 1ONELASER continuously pursues FDA Class I registration for our components to assist manufacturers and brand owners in accelerating their compliance certification process.
Global Standards & Compliance
Industrial-Grade Precision & Global Compliance
RoHS
Guarantees hazardous-free materials in our compound semiconductor manufacturing.
REACH
Strict SVHC monitoring to ensure chemical transparency across the epitaxy lifecycle.
ISO 9001:2015
Wafer-level quality control systems for consistent semiconductor production.
ISO 14001:2015
Reducing the environmental footprint of high-end optoelectronic fabrication.
ISO 45001:2018
Prioritizing operational safety within our cleanroom and lab environments.
IATF 16949:2016
Meeting automotive-grade reliability for LiDAR and advanced sensing applications.
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