905nm
905nm Multi Junction VCSEL SMD Series
905nm multi-junction VCSEL SMD series with 5W 3030 and 70W 3535 pulsed packages for LiDAR, dToF, rangefinding and SMT integration.
Specifications
- Product Type
- Multi-Junction VCSEL SMD Series
- Wavelength
- 905nm typ.
- Optical Output Power
- 4W min. / 5W typ.; 60W min. / 70W typ.
- Transverse Mode
- Multi-mode VCSEL
- Operating Mode
- QCW / Pulse
- Beam Divergence
- 20° D86 / 18° D86
- SMD Package Options
- 3030 / 3535
1. 905nm Multi-Junction VCSEL SMD Series for Pulsed Sensing and Transmitter Development
The 905nm Multi-Junction VCSEL SMD Series includes two surface-mount near-infrared VCSEL products for nanosecond-pulsed sensing, direct time-of-flight evaluation, LiDAR transmitter development, laser rangefinding and custom optical-module integration.
The series includes:
- 905nm 5W 3030 Multi-Junction VCSEL SMD
- 905nm 70W 3535 Multi-Junction VCSEL SMD
The 3030 model provides 4W minimum and 5W typical pulsed optical output at a specified drive current of 1A.
The 3535 model provides 60W minimum and 70W typical pulsed optical output at a specified drive current of 15A.
Both products use a typical 905nm peak wavelength, multi-junction VCSEL architecture and surface-mount package format.
Their different optical-output levels, pulse conditions, D86 beam-divergence values and package dimensions allow engineering teams to select a suitable device according to transmitter power, PCB space, driver capability and optical-system requirements.
The products are supplied in tape-and-reel format for surface-mount assembly and integration into complete electrical, thermal and optical systems.
Development directions include:
- Direct time-of-flight evaluation
- LiDAR transmitter evaluation
- Laser rangefinding
- Industrial distance sensing
- Object and presence detection
- Nanosecond pulsed-source development
- PCB-level VCSEL integration
- Lens, diffuser and collimator integration
- Custom optical-transmitter modules
- Engineering and research prototypes
2. 5W 3030 and 70W 3535 Model Selection
The 905nm Multi-Junction VCSEL SMD Series provides two optical-output and package configurations.
Product | Package | Optical Output Power | Drive Current | Pulse Width | Wavelength | Beam Divergence |
|---|---|---|---|---|---|---|
3030 | 4W min. / 5W typ. / 5W max. | 1A | 100ns | 899–911nm | 20° D86 | |
3535 | 60W min. / 70W typ. | 15A | 5ns | 895–915nm | 18° D86 |
Both products are characterized at 25°C and a 0.1% duty cycle.
The D86 beam-divergence value represents the beam angle defined using the D86 measurement method. It should not be replaced by an FWHM or 1/e² value.
905nm 5W 3030 Multi-Junction VCSEL SMD
It uses a 3030 SMD footprint and is characterized at a specified drive current of 1A with a 100ns pulse width and 0.1% duty cycle.
Its principal characteristics include:
- 4W minimum pulsed optical output
- 5W typical pulsed optical output
- 3030 surface-mount package
- 20° D86 beam divergence
- 100ns pulse width
- 1A specified drive current
- 4,000 pcs per reel
This model supports compact PCB-level transmitter integration, initial dToF evaluation and moderate-output rangefinding development.
905nm 70W 3535 Multi-Junction VCSEL SMD
It uses a 3535 SMD footprint and is characterized at a specified drive current of 15A with a 5ns pulse width and 0.1% duty cycle.
Its principal characteristics include:
- 60W minimum pulsed optical output
- 70W typical pulsed optical output
- 3535 surface-mount package
- 18° D86 beam divergence
- 5ns pulse width
- 15A specified drive current
- 4,000 pcs per reel
This model supports high-peak-output LiDAR, dToF and laser-rangefinding transmitter development requiring a compact SMD package.
The final model should be selected according to peak optical output, pulse width, drive-current capability, PCB dimensions, electrical parasitics, D86 beam divergence and receiver requirements.
3. SMD Package and SMT Integration
The two products are supplied as completed surface-mount VCSEL devices for PCB-level integration.
Package Parameter | 5W Model | 70W Model |
|---|---|---|
Package Type | 3030 SMD | 3535 SMD |
Nominal Package Size | 3.0 × 3.0mm | 3.4 × 3.4mm |
Nominal Package Height | 0.60mm | 1.70mm |
Internal VCSEL Chip Size | 8mil × 8mil | 18mil × 15mil |
Beam Divergence | 20° D86 | 18° D86 |
Tape-and-Reel Quantity | 4,000 pcs / reel | 4,000 pcs / reel |
Assembly Method | SMT / Reflow | SMT / Reflow |
The 3030 package provides a compact PCB footprint for lower-current pulsed transmitter development.
The 3535 package provides a larger platform for the 70W multi-junction VCSEL. Its package drawing also shows an integrated protection device.
The SMD format supports:
- Automated pick-and-place assembly
- Surface-mount PCB integration
- Tape-and-reel production
- Reflow soldering
- Compact transmitter layouts
- Lower-profile optical assemblies
- Repeatable package positioning
- Scalable volume production
Package integration should consider:
- Peak-current waveform
- Driver-to-package distance
- PCB trace inductance
- Ground-return path
- Pad geometry
- Solder-joint quality
- Package temperature
- Optical-axis alignment
- Mechanical protection
The corresponding datasheets specify that reflow soldering should be performed only once.
Pressure should not be applied to the optical package during or after reflow soldering.
The VCSEL packages are ESD-sensitive devices. Appropriate electrostatic-control procedures are required throughout storage, placement, assembly, testing and handling.
For customers developing their own die-level package, view the 905nm Multi-Junction VCSEL Bare Die Series.
4. Application Development
The 905nm Multi-Junction VCSEL SMD Series is intended for pulsed near-infrared source projects requiring a completed surface-mount package and direct PCB integration.
Application directions include:
- Direct time-of-flight evaluation
- LiDAR transmitter development
- Laser rangefinding
- Industrial distance sensing
- Object detection
- Presence and proximity sensing
- Optical timing and trigger systems
- Compact pulsed-source modules
- Customer-specific transmitter assemblies
- Engineering and laboratory evaluation
dToF, LiDAR and Laser-Rangefinding Development
For dToF, LiDAR and laser-rangefinding projects, product selection should consider working distance, receiver sensitivity, detector timing, target reflectivity, transmitter field of view, receiver field of view, pulse width, repetition rate and external optical structure.
The 5W 3030 model provides a compact lower-current option with 20° D86 beam divergence for initial transmitter and driver evaluation.
The 70W 3535 model provides substantially higher peak optical output and 18° D86 beam divergence for systems requiring stronger transmitted pulses and higher received-signal levels.
Final detection distance cannot be determined from VCSEL optical-output power alone.
It also depends on the complete transmitter, receiver, optics, signal-processing system, target conditions and operating environment.
For LiDAR, dToF and laser-rangefinding projects, product selection should consider peak optical output, pulse width, repetition rate, receiver sensitivity, detector timing, target reflectivity, optical transmission and the required field of view.
The VCSEL bare die is one component of the complete transmitter system. Final detection distance and system performance depend on the driver, package, optics, receiver, signal processing and environmental conditions.
For application-level sensing-source selection and optical-system planning, visit the Sensing & Machine Vision solution page.
For broader high-power NIR packaging, thermal-path and optical-module development, visit the High-Power NIR & Optical Modules solution page.
PCB and Optical-Module Development
The completed SMD packages allow PCB designers and optical-module developers to integrate the VCSEL directly through SMT placement and reflow production.
Possible integration directions include:
- PCB-level pulsed transmitters
- Lens-integrated SMD sources
- Diffuser-integrated optical assemblies
- Collimated transmitter modules
- Compact dToF emitters
- Application-specific rangefinding modules
- Customer-designed LiDAR transmitters
- Industrial optical-source boards
The final optical field depends on the D86 beam-divergence specification, package placement, optical-axis alignment, lens focal length, lens-to-package spacing, diffuser characteristics, package tolerance and mechanical structure.
The component does not independently determine the eye-safety classification, detection distance or regulatory status of the customer’s completed system.
For wavelength, output power, D86 beam divergence, package, optical structure and transmitter-module requirements, submit a Custom Development & ODM request.
5. Evaluation Kit and Documentation Support
The 905nm Multi-Junction VCSEL SMD Series is available for engineering evaluation, pulse-driver testing, PCB assembly development and initial optical validation.
The Evaluation Kit includes:
- 10 pcs / KIT
- One selected product model per kit
- 905nm 5W 3030 or 905nm 70W 3535 Multi-Junction VCSEL SMD
- Corresponding product datasheet
- Corresponding package-dimension file
- International shipping quoted according to destination
Evaluation can support:
- Pulse-driver evaluation
- PCB footprint verification
- SMT placement trials
- Reflow-process validation
- Electrical-parasitic evaluation
- D86 beam-divergence evaluation
- Lens and diffuser selection
- Optical alignment
- Initial dToF evaluation
- Initial rangefinding testing
The following requirements can be discussed according to the project:
- Peak wavelength
- Wavelength tolerance
- Optical output power
- Power-bin selection
- Pulse width
- Duty cycle
- D86 beam divergence
- Package configuration
- External lens or diffuser
- Custom transmitter integration
- Volume-supply requirements
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available.
Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
6. Frequently Asked Questions
FAQ 1. What models are included in the 905nm Multi-Junction VCSEL SMD Series?
The series includes two products.
The 905nm 5W 3030 model provides 4W minimum and 5W typical pulsed optical output at a specified drive current of 1A, a 100ns pulse width and 0.1% duty cycle. Its beam divergence is 20° D86.
The 905nm 70W 3535 model provides 60W minimum and 70W typical pulsed optical output at a specified drive current of 15A, a 5ns pulse width and 0.1% duty cycle. Its beam divergence is 18° D86.
Both products have a typical peak wavelength of 905nm and are supplied in tape-and-reel format.
FAQ 2. Can the 905nm VCSEL SMD packages be assembled using standard SMT production?
Yes.
The products are designed as surface-mount devices and support automated pick-and-place assembly and reflow soldering.
The PCB footprint, peak-current path, soldering profile, package temperature, ESD controls and optical alignment should be validated for the intended assembly process.
The corresponding datasheets specify one reflow-soldering cycle.
FAQ 3. Should I select the SMD Series or the 905nm VCSEL Bare Die Series?
Select the SMD Series when the project requires completed surface-mount packages for direct PCB placement, reflow assembly and faster transmitter integration.
Select bare die when the project requires a customer-designed package, die attachment, wire bonding, ceramic-submount integration or a proprietary optical package.
The appropriate format depends on the customer’s assembly capability, package design, electrical path, thermal structure and optical-system architecture.