940nm 5mW VCSEL Bare Die
940nm 5mW VCSEL bare die with a single emitter and 6mW typical output for low-power NIR sensing, custom packaging and compact OEM optical modules.
Specifications
- Product Type
- Multi-mode VCSEL Bare Die
- Wavelength
- 940 nm typ.; 930–950 nm
- Optical Output Power
- 5mW min. / 6mW typ.
- Emitter Configuration
- Single Emitter
- Operating Mode
- QCW / Pulse
- Die Size
- 170±10μm × 170±10μm
- Recommended Assembly
- Die Attach / Wire Bonding / Ceramic Submount / Custom Packaging
1. 940nm 5mW VCSEL Bare Die for Low-Power NIR Packaging and Module Integration
The 940nm 5mW VCSEL Bare Die is a compact, single-emitter, multi-mode VCSEL chip developed for chip-level packaging, ceramic-submount assembly and low-power near-infrared optical-module integration. The device provides 5mW minimum and 6mW typical optical output at IF = 7mA under a QCW test condition at 25°C.
Its 170 ±10μm × 170 ±10μm die dimensions, single-emitter configuration and low drive-current requirement position this model for compact sensing sources, optical-source evaluation and space-constrained near-infrared package development.
This compact 940nm VCSEL bare die is intended for:
- OSAT semiconductor assembly and test providers
- VCSEL and laser-diode packaging companies
- Die-attach and gold wire-bonding engineering teams
- Ceramic-submount and chip-on-board integrators
- Compact NIR optical-module manufacturers
- Low-power sensing-source developers
- Machine-vision and optical-detection companies
- Consumer-electronics optical-source developers
- Lens, diffuser and beam-shaping companies
- Laser-component distributors and second-source development teams
As an unpackaged semiconductor die, this product requires suitable die attachment, wire bonding, electrical driving, package protection and optical integration. It is not supplied as a finished SMD device, COB source, packaged laser or complete optical module.
Contact 1ONELASER to discuss 940nm 5mW VCSEL bare-die supply and packaging requirements.
2. Optical Configuration and Packaging Direction
The 940nm 5mW VCSEL Bare Die uses a compact single-emitter structure for low-power near-infrared source development. Its electrical, optical and mechanical parameters must be evaluated under the stated QCW condition, drive current, pulse width, duty cycle and temperature.
| Parameter | Value |
|---|---|
| Optical Output Power | 5mW min. / 6mW typ. at IF = 7mA |
| Center Wavelength | 940nm typ. |
| Specified Wavelength Range | 930nm min. / 940nm typ. / 950nm max. |
| Operating Condition | QCW, 0.5ms pulse width, 1% duty cycle, 25°C |
| Emitter Configuration | Single emitter |
| Forward Voltage | 1.7V min. / 1.9V typ. / 2.0V max. at IF = 7mA |
| Threshold Current | 0.9mA typ. / 1.2mA max. |
| Differential Resistance | 60Ω typ. |
| Slope Efficiency | 0.9W/A min. / 1.0W/A typ. |
| Power Conversion Efficiency | 40% min. / 42% typ. at IF = 7mA |
| Beam Divergence | 18° min. / 21° typ. / 24° max. at 1/e² |
| Die Size | 170 ±10μm × 170 ±10μm |
| Die Thickness | 130 ±10μm |
| Anode Pad Size | 90 ±5μm |
| Backside Cathode Area | 170 ±10μm × 170 ±10μm |
The device can be evaluated for conductive die attachment, gold wire bonding, ceramic-submount assembly, chip-on-board integration and application-specific compact laser packages. Package design should account for the top-side anode pad, full-area backside cathode, die dimensions, attachment material, bonding process and optical alignment.
The stated 6mW typical value is a component-level test result under the specified QCW condition. It should not be interpreted as a continuous-wave output rating. Final optical output, wavelength, operating temperature and reliability depend on the completed package, driver, pulse condition, thermal path, optics and module architecture.
View the complete 940nm VCSEL Bare Die Series.
3. Packaging, Optical Module and Application Development
OSAT and Custom VCSEL Packaging
The 940nm 5mW VCSEL Bare Die supports compact die attachment, gold wire bonding, ceramic-submount assembly and custom semiconductor-laser package development. Applicable packaging directions include:
- Compact VCSEL die attachment and bond-line evaluation
- Gold wire-bonding process development
- Ceramic-submount assembly
- Chip-on-board optical sources
- Custom SMD VCSEL packages
- TO-can laser packages
- Application-specific ceramic packages
- Compact NIR optical modules
The single-emitter configuration, 7mA test current and compact die dimensions support relatively small package layouts. Die orientation, anode-pad access, backside electrical contact, ESD control, package protection and optical-axis position must still be validated under the intended assembly process.
Lens and Optical Module Integration
The device can support optical companies and module-development teams working on compact 940nm near-infrared sources using:
- Collimation-lens assemblies
- Diffuser-integrated optical sources
- Beam-shaping components
- Lens-integrated ceramic packages
- Compact sensing-source modules
- Camera-related NIR sources
- Application-specific optical assemblies
Optical integration should be validated using the actual far-field distribution, 21° typical beam divergence, emitting-area position, package-window geometry, lens spacing, diffuser characteristics and complete module architecture. Beam divergence alone does not define the final spot size, irradiance distribution or usable optical field.
Downstream Application Development
The 940nm 5mW VCSEL Bare Die can support component-level development and engineering evaluation for:
- Low-power near-infrared sensing
- Active optical detection
- Compact NIR optical sources
- Machine-vision source evaluation
- Camera-related NIR source development
- Consumer-electronics optical sensing
- Industrial optical detection
- Engineering and research light sources
- Customer-specific packaged VCSEL products
These are downstream development directions after the bare die has been integrated into a suitable electrical, mechanical and optical system. The component does not independently establish detection distance, optical uniformity, eye-safety classification, finished-device performance or regulatory approval.
The finished-device developer must independently validate the driver condition, received optical signal, working distance, package temperature, beam distribution, laser classification, electrical safety and complete-system requirements.
Explore component-level VCSEL development for Sensing & Machine Vision.
4. Evaluation Kit and Documentation Support
The 940nm 5mW VCSEL Bare Die can be evaluated for die-attach trials, wire-bonding verification, ceramic-submount development, QCW driver testing and initial compact optical-module integration.
The Evaluation Kit includes:
- 10 pcs / KIT
- 940nm 5mW VCSEL Bare Die
- Corresponding product datasheet
- Corresponding die-dimension documentation
- International shipping quoted according to destination
The following requirements can be discussed according to the project:
- Center wavelength and wavelength tolerance
- Optical output and power-bin selection
- Single-emitter chip configuration
- QCW driver and pulse requirements
- Die attachment, wire bonding and ceramic-submount design
- Custom SMD, TO-can or ceramic packaging
- Lens, diffuser and optical-module integration
- Volume-supply requirements
Request a 940nm 5mW VCSEL Bare Die Evaluation Kit.
Submit a Custom Development & ODM request.
For component-level project evaluation, an Initial Product Report covering the Laser Diode Series and VCSEL Laser Diode Chip Series has been filed with the U.S. FDA CDRH. This filing supports technical documentation and product evaluation.
For applicable products, CE, EMC, EN 60825, LVD, RoHS, REACH and halogen-free certification and compliance documents are available. Documentation depends on the corresponding product model and does not represent certification of the customer’s finished device.
5. Frequently Asked Questions
FAQ 1. What packaging and operating conditions are required for the 940nm 5mW VCSEL Bare Die?
The device is supplied as an unpackaged semiconductor die and requires conductive die attachment, top-side wire bonding, ESD-controlled handling and package-level protection. Its 6mW typical optical output is measured at IF = 7mA, 25°C, a 0.5ms pulse width and 1% duty cycle. The package should provide reliable backside cathode contact, access to the anode pad and suitable optical alignment. Different current, pulse, temperature or thermal conditions require separate electrical and optical validation.
FAQ 2. When should I select the 940nm 5mW device instead of a higher-power VCSEL bare die or completed package?
The 5mW model is suitable when the project requires a compact single-emitter die, low test current and limited optical output for sensing or source evaluation. Higher-power 940nm models may be more appropriate when greater illumination power, increased emitter count or a larger optical field is required. The bare die is intended for customers developing their own package or optical assembly. Projects requiring a reflow-ready component or completed source should follow an SMD, ceramic-package or module-development path.
FAQ 3. Can the 940nm 5mW VCSEL Bare Die be evaluated for sensing and machine-vision projects?
Yes. The device can support component-level evaluation for low-power NIR sensing, active optical detection, consumer-electronics optical sources and compact machine-vision support. Engineering evaluation should cover the QCW operating condition, beam divergence, package geometry, lens position, detector response, working distance and received signal. The bare die is not a complete sensing system and does not independently determine detection range, optical safety or finished-product performance. Custom packaging and optical integration can be discussed for qualified projects.