
680nm 50mW VCSEL Bare Die
680nm 50mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and high-output red VCSEL chip integration.

680nm 50mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and high-output red VCSEL chip integration.

680nm 18mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 6-emitter red VCSEL chip integration.

680nm 12mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 4-emitter red VCSEL chip integration.

680nm 5mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and red VCSEL chip integration.

680nm 5/12/18/50mW VCSEL Bare Die Series for wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.

680nm 5mW and 34mW peak-output QCW VCSEL SMD series in 2835, 3030 and 5730 packages for scalp PBM, localized red-light and PCB integration.

670nm 12mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 6-emitter red VCSEL chip integration.

670nm 4mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and red VCSEL chip integration.

670nm 9mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 4-emitter red VCSEL chip integration.

670nm 4/9/12mW VCSEL Bare Die Series for wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.

665nm 9mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 6-emitter red VCSEL chip integration.

665nm 8mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 4-emitter red VCSEL chip integration.

665nm 7mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and 4-emitter red VCSEL chip integration.

665nm 3mW VCSEL Bare Die for die attach, gold-wire bonding, ceramic submount assembly, custom VCSEL packaging and red VCSEL chip integration.

665nm 3/7/8/9mW VCSEL Bare Die Series for wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.

660nm 7mW VCSEL Bare Die for wire bonding, ceramic submount assembly, custom laser packaging and higher-output red VCSEL chip integration.

660nm 5mW VCSEL Bare Die for die attach, wire bonding, ceramic submount assembly, custom laser packaging and red VCSEL chip integration projects.

660nm 2mW single-emitter VCSEL bare die for wire bonding, ceramic submount assembly, custom laser packaging and compact red-light module integration.

660nm 2mW, 5mW and 7mW VCSEL bare die series with single- and multi-emitter options for wire bonding, ceramic submounts and custom laser packaging.

660nm 5mW and 7mW VCSEL SMD packages for beauty masks, localized red-light PBM devices and compact PCB-based optical systems.

1064nm 5mW VCSEL SMD in a compact 2835 package for security monitoring, night-vision equipment, PCB integration and custom NIR optical modules.